Effect of thiourea on copper dissolution and deposition

Maher Alodan, William Smyrl

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The effect of thiourea on copper was investigated in solutions of sulfuric acid. Weak interaction occurs at low concentrations of thiourea. At high concentrations of thiourea (> 1 mM), strong effects were observed. Thiourea forms complexes with cuprous ions in solution which shift the open circuit potential of the copper electrode in a negative direction and causes copper to dissolve to cuprous species even in sulfate media. At more positive potentials, thiourea reacts with cupric ions and forms a complex. At a sufficient concentration of the cupricthiourea complex, a sulfate complex film forms. The film can be formed reversibly upon cycling the copper electrode potential.

Original languageEnglish (US)
Pages (from-to)299-309
Number of pages11
JournalElectrochimica Acta
Issue number2-3
StatePublished - Sep 15 1998


  • Brightening
  • Copper electrodeposition
  • Leveling
  • Quartz crystal microbalance
  • Thiourea


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