Abstract
The effect of thiourea on copper was investigated in solutions of sulfuric acid. Weak interaction occurs at low concentrations of thiourea. At high concentrations of thiourea (> 1 mM), strong effects were observed. Thiourea forms complexes with cuprous ions in solution which shift the open circuit potential of the copper electrode in a negative direction and causes copper to dissolve to cuprous species even in sulfate media. At more positive potentials, thiourea reacts with cupric ions and forms a complex. At a sufficient concentration of the cupricthiourea complex, a sulfate complex film forms. The film can be formed reversibly upon cycling the copper electrode potential.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 299-309 |
| Number of pages | 11 |
| Journal | Electrochimica Acta |
| Volume | 44 |
| Issue number | 2-3 |
| DOIs | |
| State | Published - Sep 15 1998 |
Keywords
- Brightening
- Copper electrodeposition
- Leveling
- Quartz crystal microbalance
- Thiourea