Effect of thiourea on copper dissolution and deposition

Maher Alodan, William Smyrl

Research output: Contribution to journalArticle

82 Scopus citations

Abstract

The effect of thiourea on copper was investigated in solutions of sulfuric acid. Weak interaction occurs at low concentrations of thiourea. At high concentrations of thiourea (> 1 mM), strong effects were observed. Thiourea forms complexes with cuprous ions in solution which shift the open circuit potential of the copper electrode in a negative direction and causes copper to dissolve to cuprous species even in sulfate media. At more positive potentials, thiourea reacts with cupric ions and forms a complex. At a sufficient concentration of the cupricthiourea complex, a sulfate complex film forms. The film can be formed reversibly upon cycling the copper electrode potential.

Original languageEnglish (US)
Pages (from-to)299-309
Number of pages11
JournalElectrochimica Acta
Volume44
Issue number2-3
DOIs
StatePublished - Sep 15 1998

Keywords

  • Brightening
  • Copper electrodeposition
  • Leveling
  • Quartz crystal microbalance
  • Thiourea

Fingerprint Dive into the research topics of 'Effect of thiourea on copper dissolution and deposition'. Together they form a unique fingerprint.

  • Cite this