@inbook{ea2bbc60c3a3497f8ff870596185856b,
title = "Effect of in and out of plane stresses during indentation of diamond films on metal substrates",
abstract = "Diamond films grown on molybdenum substrates are indented with conical diamond indenters to depths more than 5 times the thickness of the film. This causes delamination and spalling of the film. The effects of variations in indenter angle and film thickness are demonstrated. Using a radius of the delaminated area to the residual contact radius, sharper indenters are shown to cause a 10 to 20% change in that ratio. For films greater than 5 μm thick, there is no apparent film thickness effect. Possibilities for this observation are cracking due to bending stresses or the interfacial crack kinking out of the interface due to a reduction in compressive stresses, leading to mixed mode loading. The strain energy release rate of the interface for an 800 nm diamond film on molybdenum is between 2.4 and 7 J/m2.",
author = "Bahr, {D. F.} and Gerberich, {W. W.}",
year = "1996",
doi = "10.1557/proc-436-85",
language = "English (US)",
series = "Materials Research Society Symposium - Proceedings",
booktitle = "Thin Films",
note = "Proceedings of the 1996 MRS Spring Meeting ; Conference date: 08-04-1996 Through 11-04-1996",
}