Effect of in and out of plane stresses during indentation of diamond films on metal substrates

D. F. Bahr, W. W. Gerberich

Research output: Chapter in Book/Report/Conference proceedingChapter

2 Scopus citations

Abstract

Diamond films grown on molybdenum substrates are indented with conical diamond indenters to depths more than 5 times the thickness of the film. This causes delamination and spalling of the film. The effects of variations in indenter angle and film thickness are demonstrated. Using a radius of the delaminated area to the residual contact radius, sharper indenters are shown to cause a 10 to 20% change in that ratio. For films greater than 5 μm thick, there is no apparent film thickness effect. Possibilities for this observation are cracking due to bending stresses or the interfacial crack kinking out of the interface due to a reduction in compressive stresses, leading to mixed mode loading. The strain energy release rate of the interface for an 800 nm diamond film on molybdenum is between 2.4 and 7 J/m2.

Original languageEnglish (US)
Title of host publicationThin Films
Subtitle of host publicationStresses and Mechanical Properties VI
DOIs
StatePublished - Jan 1 1996
EventProceedings of the 1996 MRS Spring Meeting - San Francisco, CA, USA
Duration: Apr 8 1996Apr 11 1996

Publication series

NameMaterials Research Society Symposium - Proceedings
Volume436
ISSN (Print)0272-9172

Other

OtherProceedings of the 1996 MRS Spring Meeting
CitySan Francisco, CA, USA
Period4/8/964/11/96

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