Dummy fill optimization for enhanced manufacturability

Yaoguang Wei; Sachin S. Sapatnekar

doi:10.1145/1735023.1735051

Dummy fill optimization for enhanced manufacturability

Yaoguang Wei, Sachin S. Sapatnekar

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

This paper presents a router that minimizes the amount of dummy fill necessary to satisfy the requirements for chemical-mechanical polishing (CMP). The algorithm uses a greedy strategy and effective cost functions to control the maximal effective pattern density during routing. On a standard set of benchmark circuits, our CMP-aware router can reduce the required dummy fill by 22.0% on average, and up to 41.5%, as compared to the CMP-unaware case. In comparison with another CMP-aware routing approach, our algorithm is demonstrated to reduce the amount of dummy fill by 14.1% on average, and up to 23.6%, over the benchmarks.

Original language	English (US)
Title of host publication	ISPD'10 - Proceedings of the 2010 ACM International Symposium on Physical Design
Pages	97-104
Number of pages	8
DOIs	https://doi.org/10.1145/1735023.1735051
State	Published - 2010
Event	2010 ACM International Symposium on Physical Design, ISPD'10 - San Francisco, CA, United States Duration: Mar 14 2010 → Mar 17 2010

Publication series

Name	Proceedings of the International Symposium on Physical Design

Conference

Conference	2010 ACM International Symposium on Physical Design, ISPD'10
Country/Territory	United States
City	San Francisco, CA
Period	3/14/10 → 3/17/10

Keywords

Chemical-mechanical polishing
Design for manufacturability
Dummy fill
Routing

Publisher link

10.1145/1735023.1735051

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Wei, Y & Sapatnekar, SS 2010, Dummy fill optimization for enhanced manufacturability. in ISPD'10 - Proceedings of the 2010 ACM International Symposium on Physical Design. Proceedings of the International Symposium on Physical Design, pp. 97-104, 2010 ACM International Symposium on Physical Design, ISPD'10, San Francisco, CA, United States, 3/14/10. https://doi.org/10.1145/1735023.1735051

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title = "Dummy fill optimization for enhanced manufacturability",

abstract = "This paper presents a router that minimizes the amount of dummy fill necessary to satisfy the requirements for chemical-mechanical polishing (CMP). The algorithm uses a greedy strategy and effective cost functions to control the maximal effective pattern density during routing. On a standard set of benchmark circuits, our CMP-aware router can reduce the required dummy fill by 22.0% on average, and up to 41.5%, as compared to the CMP-unaware case. In comparison with another CMP-aware routing approach, our algorithm is demonstrated to reduce the amount of dummy fill by 14.1% on average, and up to 23.6%, over the benchmarks.",

keywords = "Chemical-mechanical polishing, Design for manufacturability, Dummy fill, Routing",

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series = "Proceedings of the International Symposium on Physical Design",

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AB - This paper presents a router that minimizes the amount of dummy fill necessary to satisfy the requirements for chemical-mechanical polishing (CMP). The algorithm uses a greedy strategy and effective cost functions to control the maximal effective pattern density during routing. On a standard set of benchmark circuits, our CMP-aware router can reduce the required dummy fill by 22.0% on average, and up to 41.5%, as compared to the CMP-unaware case. In comparison with another CMP-aware routing approach, our algorithm is demonstrated to reduce the amount of dummy fill by 14.1% on average, and up to 23.6%, over the benchmarks.

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KW - Design for manufacturability

KW - Dummy fill

KW - Routing

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Dummy fill optimization for enhanced manufacturability

Abstract

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