Dummy fill optimization for enhanced manufacturability

Yaoguang Wei, Sachin S. Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

This paper presents a router that minimizes the amount of dummy fill necessary to satisfy the requirements for chemical-mechanical polishing (CMP). The algorithm uses a greedy strategy and effective cost functions to control the maximal effective pattern density during routing. On a standard set of benchmark circuits, our CMP-aware router can reduce the required dummy fill by 22.0% on average, and up to 41.5%, as compared to the CMP-unaware case. In comparison with another CMP-aware routing approach, our algorithm is demonstrated to reduce the amount of dummy fill by 14.1% on average, and up to 23.6%, over the benchmarks.

Original languageEnglish (US)
Title of host publicationISPD'10 - Proceedings of the 2010 ACM International Symposium on Physical Design
Pages97-104
Number of pages8
DOIs
StatePublished - May 19 2010
Event2010 ACM International Symposium on Physical Design, ISPD'10 - San Francisco, CA, United States
Duration: Mar 14 2010Mar 17 2010

Publication series

NameProceedings of the International Symposium on Physical Design

Conference

Conference2010 ACM International Symposium on Physical Design, ISPD'10
CountryUnited States
CitySan Francisco, CA
Period3/14/103/17/10

Keywords

  • Chemical-mechanical polishing
  • Design for manufacturability
  • Dummy fill
  • Routing

Fingerprint Dive into the research topics of 'Dummy fill optimization for enhanced manufacturability'. Together they form a unique fingerprint.

Cite this