Diffusional phase transformations in self-stressed solid films

Y. Zhen, P. H. Leo

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Diffusional phase transformations in stressed solid films are simulated by using an analytical solution for the elastic fields together with a numerical solution for the composition evolution. Isotropic and anisotropic (cubic) films are considered, where the film is either free-standing or attached to a substrate. Stresses in the film arise owing to both compositional self-stress and, in the film-substrate case, misfit between the film and substrate. Stresses are found by using analytical elastic solutions we developed for both the two- and three-dimensional cases. Numerical simulations in both two- and three-dimensions are performed using a Cahn-Hilliard model for the composition evolution. Results show that elastic strength, epitaxial misfit, elastic anisotropy, external mechanical loading and film-substrate geometry affect both the kinetics of evolution and the long-time configurations of the evolution. In particular, we observe phenomena such as formation of columnar structures, switching of layers, and phase alignment in preferred directions.

Original languageEnglish (US)
Pages (from-to)223-234
Number of pages12
JournalThin Solid Films
Volume513
Issue number1-2
DOIs
StatePublished - Aug 14 2006

Fingerprint

phase transformations
Phase transitions
Substrates
proportional limit
elastic anisotropy
Chemical analysis
Anisotropy
alignment
Kinetics
Geometry
Computer simulation
kinetics
geometry
configurations
simulation

Keywords

  • Cahn-Hilliard model
  • Computer simulation
  • Elastic anisotropy
  • Epitaxial misfit

Cite this

Diffusional phase transformations in self-stressed solid films. / Zhen, Y.; Leo, P. H.

In: Thin Solid Films, Vol. 513, No. 1-2, 14.08.2006, p. 223-234.

Research output: Contribution to journalArticle

@article{742f759cd32e468b9d8cf4ade90d6168,
title = "Diffusional phase transformations in self-stressed solid films",
abstract = "Diffusional phase transformations in stressed solid films are simulated by using an analytical solution for the elastic fields together with a numerical solution for the composition evolution. Isotropic and anisotropic (cubic) films are considered, where the film is either free-standing or attached to a substrate. Stresses in the film arise owing to both compositional self-stress and, in the film-substrate case, misfit between the film and substrate. Stresses are found by using analytical elastic solutions we developed for both the two- and three-dimensional cases. Numerical simulations in both two- and three-dimensions are performed using a Cahn-Hilliard model for the composition evolution. Results show that elastic strength, epitaxial misfit, elastic anisotropy, external mechanical loading and film-substrate geometry affect both the kinetics of evolution and the long-time configurations of the evolution. In particular, we observe phenomena such as formation of columnar structures, switching of layers, and phase alignment in preferred directions.",
keywords = "Cahn-Hilliard model, Computer simulation, Elastic anisotropy, Epitaxial misfit",
author = "Y. Zhen and Leo, {P. H.}",
year = "2006",
month = "8",
day = "14",
doi = "10.1016/j.tsf.2006.01.057",
language = "English (US)",
volume = "513",
pages = "223--234",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",
number = "1-2",

}

TY - JOUR

T1 - Diffusional phase transformations in self-stressed solid films

AU - Zhen, Y.

AU - Leo, P. H.

PY - 2006/8/14

Y1 - 2006/8/14

N2 - Diffusional phase transformations in stressed solid films are simulated by using an analytical solution for the elastic fields together with a numerical solution for the composition evolution. Isotropic and anisotropic (cubic) films are considered, where the film is either free-standing or attached to a substrate. Stresses in the film arise owing to both compositional self-stress and, in the film-substrate case, misfit between the film and substrate. Stresses are found by using analytical elastic solutions we developed for both the two- and three-dimensional cases. Numerical simulations in both two- and three-dimensions are performed using a Cahn-Hilliard model for the composition evolution. Results show that elastic strength, epitaxial misfit, elastic anisotropy, external mechanical loading and film-substrate geometry affect both the kinetics of evolution and the long-time configurations of the evolution. In particular, we observe phenomena such as formation of columnar structures, switching of layers, and phase alignment in preferred directions.

AB - Diffusional phase transformations in stressed solid films are simulated by using an analytical solution for the elastic fields together with a numerical solution for the composition evolution. Isotropic and anisotropic (cubic) films are considered, where the film is either free-standing or attached to a substrate. Stresses in the film arise owing to both compositional self-stress and, in the film-substrate case, misfit between the film and substrate. Stresses are found by using analytical elastic solutions we developed for both the two- and three-dimensional cases. Numerical simulations in both two- and three-dimensions are performed using a Cahn-Hilliard model for the composition evolution. Results show that elastic strength, epitaxial misfit, elastic anisotropy, external mechanical loading and film-substrate geometry affect both the kinetics of evolution and the long-time configurations of the evolution. In particular, we observe phenomena such as formation of columnar structures, switching of layers, and phase alignment in preferred directions.

KW - Cahn-Hilliard model

KW - Computer simulation

KW - Elastic anisotropy

KW - Epitaxial misfit

UR - http://www.scopus.com/inward/record.url?scp=33745273237&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33745273237&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2006.01.057

DO - 10.1016/j.tsf.2006.01.057

M3 - Article

AN - SCOPUS:33745273237

VL - 513

SP - 223

EP - 234

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

IS - 1-2

ER -