Diffusion bonding of the textured Ni tapes for the substrate of YBCO coated conductors

Doohoon Goo, Sanghyun Oh, Jun Ho Kim, Kookchae Jung, D. Youm

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Two pieces of the textured Ni tapes were diffusively bonded under mechanical pressure, 0.3 MPa at 1400°C in a vacuum furnace. The cross-sectional view by SEM showed a good bonding without voids in the bonding line and the XRD measurements indicated it was still well textured. The buffer layer, CeO2, and the superconducting layer, YBCO, were successively deposited on the bonded tapes and were confirmed to be well textured.

Original languageEnglish (US)
Pages (from-to)221-226
Number of pages6
JournalPhysica C: Superconductivity and its applications
Volume305
Issue number3-4
DOIs
StatePublished - Sep 1 1998

Keywords

  • Bonding
  • Ni tape
  • Superconducting
  • Texture
  • YBCO

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