Dielectrophoretic assembly of electrically functional microwires from nanoparticle suspensions

K. D. Hermanson, S. O. Lumsdon, J. P. Williams, E. W. Kaler, O. D. Velev

Research output: Contribution to journalArticle

497 Scopus citations

Abstract

A new class of microwires can be assembled by die[ectrophoresis from suspensions of metallic nanoparticles. The wires are formed in the gaps between planar electrodes and can grow faster than 50 micrometers per second to lengths exceeding 5 millimeters. They have good ohmic conductance and automatically form electrical connections to conductive islands or particles. The thickness and the fractal dimension of the wires can be controlled, and composite wires with a metallic core surrounded by a latex shell can be assembled. The simple assembly process and their high surface-to-volume ratio make these structures promising for wet electronic and bioelectronic circuits.

Original languageEnglish (US)
Pages (from-to)1082-1086
Number of pages5
JournalScience
Volume294
Issue number5544
DOIs
StatePublished - Nov 2 2001

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