Development of ultrabroadband (DC50 GHz) wafer-scale packaging method for low-profile bump flip-chip technology

Keyphrases

• Bump 100%
• Ultra-broadband 100%
• Wafer-level Packaging 100%
• Low Profile 100%
• Flip-chip Interconnect 100%
• Flip-chip Technology 100%
• Packaging Method 100%
• Return Loss 50%
• Flip chip 50%
• Performance Improvement 25%
• Transition Region 25%
• Capacitance 25%
• Design Rules 25%
• Optimum Percentage 25%
• Coplanar Waveguide 25%
• Micromachining 25%
• Insertion Loss 25%
• Interconnect Design 25%
• Compensation Method 25%
• Air Cavity 25%
• Impedance Mismatch 25%
• Capacitive Compensation 25%
• GHz Bandwidth 25%

Computer Science

• Chip Technology 100%
• Transition Region 100%
• coplanar waveguide 100%
• Impedance Mismatch 100%
• Performance Improvement 100%
• Percentage Change 100%
• Insertion Loss 100%

Engineering

• Interconnects 100%
• Return Loss 50%
• Capacitive 25%
• Waveguide 25%
• Performance Improvement 25%
• Insertion Loss 25%
• Design Rule 25%
• Air Cavity 25%