Development of nanostructured wick-based passive heat spreader for thermal management of radio frequency electronic devices

David Altman; Justin Weibel; Suresh Garimella; Jayathi Murthy; Timothy Fisher; Sungwon Kim; Youssef Habib; Jason Nadler; Tianhong Cui; Ram Ranjan

Development of nanostructured wick-based passive heat spreader for thermal management of radio frequency electronic devices

David Altman, Justin Weibel, Suresh Garimella, Jayathi Murthy, Timothy Fisher, Sungwon Kim, Youssef Habib, Jason Nadler, Tianhong Cui, Ram Ranjan

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English (US)
Title of host publication	International Conference and Exhibition on Device Packaging 2009
Pages	1440-1461
Number of pages	22
State	Published - Dec 1 2008
Externally published	Yes
Event	International Conference and Exhibition on Device Packaging 2009 - Scottsdale/Fountain Hills, AZ, United States Duration: Mar 9 2009 → Mar 12 2009

Publication series

Name	International Conference and Exhibition on Device Packaging 2009
Volume	3

Conference

Conference	International Conference and Exhibition on Device Packaging 2009
Country/Territory	United States
City	Scottsdale/Fountain Hills, AZ
Period	3/9/09 → 3/12/09

Find It

Find It at U of M Libraries

Cite this

Altman, D., Weibel, J., Garimella, S., Murthy, J., Fisher, T., Kim, S., Habib, Y., Nadler, J., Cui, T., & Ranjan, R. (2008). Development of nanostructured wick-based passive heat spreader for thermal management of radio frequency electronic devices. In International Conference and Exhibition on Device Packaging 2009 (pp. 1440-1461). (International Conference and Exhibition on Device Packaging 2009; Vol. 3).

Development of nanostructured wick-based passive heat spreader for thermal management of radio frequency electronic devices. / Altman, David; Weibel, Justin; Garimella, Suresh et al.
International Conference and Exhibition on Device Packaging 2009. 2008. p. 1440-1461 (International Conference and Exhibition on Device Packaging 2009; Vol. 3).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Altman, D, Weibel, J, Garimella, S, Murthy, J, Fisher, T, Kim, S, Habib, Y, Nadler, J, Cui, T & Ranjan, R 2008, Development of nanostructured wick-based passive heat spreader for thermal management of radio frequency electronic devices. in International Conference and Exhibition on Device Packaging 2009. International Conference and Exhibition on Device Packaging 2009, vol. 3, pp. 1440-1461, International Conference and Exhibition on Device Packaging 2009, Scottsdale/Fountain Hills, AZ, United States, 3/9/09.

@inproceedings{8c0af5bb3139444c8d07741d96aa706e,

title = "Development of nanostructured wick-based passive heat spreader for thermal management of radio frequency electronic devices",

author = "David Altman and Justin Weibel and Suresh Garimella and Jayathi Murthy and Timothy Fisher and Sungwon Kim and Youssef Habib and Jason Nadler and Tianhong Cui and Ram Ranjan",

year = "2008",

month = dec,

day = "1",

language = "English (US)",

isbn = "9781615673254",

series = "International Conference and Exhibition on Device Packaging 2009",

pages = "1440--1461",

booktitle = "International Conference and Exhibition on Device Packaging 2009",

note = "International Conference and Exhibition on Device Packaging 2009 ; Conference date: 09-03-2009 Through 12-03-2009",

}

TY - GEN

T1 - Development of nanostructured wick-based passive heat spreader for thermal management of radio frequency electronic devices

AU - Altman, David

AU - Weibel, Justin

AU - Garimella, Suresh

AU - Murthy, Jayathi

AU - Fisher, Timothy

AU - Kim, Sungwon

AU - Habib, Youssef

AU - Nadler, Jason

AU - Cui, Tianhong

AU - Ranjan, Ram

PY - 2008/12/1

Y1 - 2008/12/1

UR - http://www.scopus.com/inward/record.url?scp=84877789849&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84877789849&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84877789849

SN - 9781615673254

T3 - International Conference and Exhibition on Device Packaging 2009

SP - 1440

EP - 1461

BT - International Conference and Exhibition on Device Packaging 2009

T2 - International Conference and Exhibition on Device Packaging 2009

Y2 - 9 March 2009 through 12 March 2009

ER -

Development of nanostructured wick-based passive heat spreader for thermal management of radio frequency electronic devices

Publication series

Conference

Find It

Other files and links

Cite this