TY - JOUR
T1 - Design, simulation, fabrication, and characterization of a PMMA tunneling sensor based on hot embossing technique
AU - Wang, J.
AU - Cui, T.
PY - 2005/6/1
Y1 - 2005/6/1
N2 - Polymethyl methacrylate (PMMA) was chosen to fabricate highly sensitive tunneling sensors due to its extremely low cost and quick machining by hot embossing. The structure of an all-PMMA-based membrane vertical tunneling sensor platform was synthesized by ANSYS. The system characteristics and feedback system were evaluated with MatLab SimuLink. The first all-PMMA-based membrane tunneling transducers were produced by hot embossing replication with silicon masters. The fabricated tunneling sensors have presented a tunneling barrier height of 0.17 eV, a sensitivity of 26 V/g, and a dynamic range of 1.5 mg, which demonstrated competitive performances with lower cost, lighter weight, and easier fabrication processing.
AB - Polymethyl methacrylate (PMMA) was chosen to fabricate highly sensitive tunneling sensors due to its extremely low cost and quick machining by hot embossing. The structure of an all-PMMA-based membrane vertical tunneling sensor platform was synthesized by ANSYS. The system characteristics and feedback system were evaluated with MatLab SimuLink. The first all-PMMA-based membrane tunneling transducers were produced by hot embossing replication with silicon masters. The fabricated tunneling sensors have presented a tunneling barrier height of 0.17 eV, a sensitivity of 26 V/g, and a dynamic range of 1.5 mg, which demonstrated competitive performances with lower cost, lighter weight, and easier fabrication processing.
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U2 - 10.1007/s00542-004-0490-4
DO - 10.1007/s00542-004-0490-4
M3 - Article
AN - SCOPUS:18744395805
SN - 0946-7076
VL - 11
SP - 452
EP - 455
JO - Microsystem Technologies
JF - Microsystem Technologies
IS - 6
ER -