Design of a cooling system for microchips with high heat-flux density using integrated microchannels

Shufang Wang, Debao Zhou, Zhiyong Yang

Research output: Contribution to journalArticlepeer-review


With the improvement of the integration technology, the heat-flux density in microchips has reached 1 kW/cm2. Traditional cooling methods cannot control the temperature below 393 K as desired. Thus chip cooling has become the bottleneck for further integration. To ensure a normal working condition, this paper proposed to use a microfluid to discharge the internal heat, by making the fluid flow through the integrated microchannels in a chip. To realize this, the present work firstly focused on the design of the microchannels based on a desired model of a microchip. Secondly, to find the optimized size of the microchannels, numerical simulation was performed. It was found that the diameter of the microchannels at 40 mm could keep the chip temperature around 393 K. Further experiments have been performed to verify the numerical results. Both the numerical and experimental results have shown that the highest temperature of a chip can be controlled to as low as 370 K through combining and adjusting the bidirectional flow, entering velocity, and entering temperature. These results proved the feasibility of the chip cooling concept using microchannels.

Original languageEnglish (US)
Pages (from-to)1299-1312
Number of pages14
JournalHeat Transfer Research
Issue number14
StatePublished - Jan 1 2017


  • Cooling System
  • High Heat-flux density
  • Microchannels
  • Microchips
  • MicroflUid

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