Abstract
Resistive random-access memory (RRAM)-based in-memory computing (IMC) architecture offers an energy-efficient solution for DNN acceleration. Yet, its performance is limited by device non-idealities, circuit precision, on-chip interconnection, and algorithm properties. Based on statistical data from a fully-integrated 65nm CMOS/RRAM test chip and a cross-layer simulation framework, we show that the IMC system's real bottleneck is not the RRAM device but the analog-to-digital converter (ADC) precision and the stability of DNN models. The results are summarized into a roofline model and demonstrated on CIFAR-10, SVHN, CIFAR-100, and ImageNet, helping understand RRAM-based IMC architectures' design limits.
Original language | English (US) |
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Title of host publication | 2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781728181769 |
DOIs | |
State | Published - Apr 8 2021 |
Externally published | Yes |
Event | 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 - Chengdu, China Duration: Apr 8 2021 → Apr 11 2021 |
Publication series
Name | 2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 |
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Conference
Conference | 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 |
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Country/Territory | China |
City | Chengdu |
Period | 4/8/21 → 4/11/21 |
Bibliographical note
Funding Information:This work was supported in part by the Semiconductor Research Corporation (SRC) and DARPA, the National Science Foundation (NSF) under CCF-1715443, and the Air Force Research Laboratory award #FA8750-19-1-0014.
Publisher Copyright:
© 2021 IEEE.