Deposition and modeling of hard, wear-resistant Si-C-N coatings

Nicole J. Wagner, William W Gerberich, Joachim V.R. Heberlein

Research output: Contribution to journalArticlepeer-review

3 Scopus citations


Hard, wear-resistant Si-C-N coatings were produced via a thermal plasma chemical vapor deposition process in a triple torch reactor. Vaporized hexamethyldisilazane (HMDSN) and nitrogen and/or hydrogen gases were dissociated through the argon plasma as additional reactants. Several Si-C-N coatings were synthesized with varying reactant flows and substrate temperature. Film composition, morphology, and mechanical performance were examined. Hardness and elastic modulus increased with decreasing N:H gas ratio, decreasing roughness, and the inclusion of nanocrystallites. A kinetic reaction mechanism determined that the atomic species primarily existed in the substrate boundary layer. The Damköhler number was calculated to predict the necessary reactant composition for morphologically smooth films.

Original languageEnglish (US)
Pages (from-to)S946-S951
JournalPlasma Processes and Polymers
Issue numberSUPPL.1
StatePublished - Dec 1 2007


  • Films
  • Kinetics
  • Plasma-enhanced chemical vapor deposition (PECVD)
  • Silicon carbide
  • Silicon nitride
  • Wear


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