Demonstration of bond quality improvement for closed loop control of thermoplastic tape-laying

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In thermoplastic tape-laying, the temperature at the interface between the top ply and substrate is critical to achieving interlaminar bonding. Based on a three lump process model, a Kalman filter and a state feedback controller were built to successfully estimate and control the interlaminar bonding temperature during the process. A practical advantage of this controller is that the only measurement required is the heater temperature. In this work, two methods are used to examine the bond quality when applying this feedback control method. One method is a microscopy study and the other is a lap shear strength test. Specimens were manufactured using the developed controller to regulate the bonding temperature. The microscopy pictures show that the interlaminar bond width is reduced as the bonding temperature is increased. The lap shear strength tests show that the bond strength is significantly improved as the bonding temperature is raised. Both test results have consistently demonstrated the causal relationship between interlaminar bonding temperature and bond quality. The control method produces high quality laminates by using temperature feedback from the heater to estimate the interlaminar bonding temperature.

Original languageEnglish (US)
Pages (from-to)57-76
Number of pages20
JournalJournal of Composite Materials
Issue number1
StatePublished - Jan 1 2001


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