A review of advances in contact technology for 2D material MOSFETs is provided. Phase-engineered contacts to transition metal dichalcogenides (TMDCs) are reviewed, along with recent progress on semimetallic contacts to TMDCs. Finally, the outstanding manufacturing challenges are discussed.
|Original language||English (US)|
|Title of host publication||7th IEEE Electron Devices Technology and Manufacturing Conference|
|Subtitle of host publication||Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023|
|Publisher||Institute of Electrical and Electronics Engineers Inc.|
|State||Published - 2023|
|Event||7th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2023 - Seoul, Korea, Republic of|
Duration: Mar 7 2023 → Mar 10 2023
|Name||7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023|
|Conference||7th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2023|
|Country/Territory||Korea, Republic of|
|Period||3/7/23 → 3/10/23|
Bibliographical noteFunding Information:
The authors acknowledge support from Intel Corporation and DTRA through Award No. HDTRA1-14-1-0042. In addition, portions of this work were conducted in the Minnesota Nano Center, which is supported by the NSF through the NNCI under Award No. ECCS-2025124.
© 2023 IEEE.
- 2D materials