Original language | English (US) |
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Title of host publication | Handbook of 3D Integration |
Subtitle of host publication | Technology and Applications of 3D Integrated Circuits |
Publisher | John Wiley and Sons |
Pages | 583-597 |
Number of pages | 15 |
Volume | 2 |
ISBN (Print) | 9783527320349 |
DOIs | |
State | Published - Nov 25 2008 |
Keywords
- 3D circuits
- Computer-aided design
- Power grid
- Thermal analysis