Abstract
The authors report on a complementary III-V heterostructure FET (HFET) technology that makes use of high AlAs mole fraction (Al,Ga)As barrier layers to reduce the gate leakage currents of n- and p-channel heterostructure FETs. The subthreshold currents and drain-to-gate leakage currents of p-HFETs are also substantially reduced as a result of the high AlAs mole fraction (Al,Ga)As barrier layer. A 1024 × 1 bit complementary HFET SRAM with access times as low as 4.6 ns and power dissipation of 34.8 mW has also been demonstrated using this technology.
Original language | English (US) |
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Pages (from-to) | 983-986 |
Number of pages | 4 |
Journal | Technical Digest - International Electron Devices Meeting |
State | Published - Dec 1 1990 |
Event | 1990 International Electron Devices Meeting - San Francisco, CA, USA Duration: Dec 9 1990 → Dec 12 1990 |