Abstract
In the double-sided polishing process both faces of the workpiece are polished simultaneously under apparently identical conditions. However, differences are observed in the material removal rate between the two workpiece faces, and over a series of polishing runs, the side from which more material is removed changes. Polishing process models describing material removal rate were developed and compared to observed behavior. The side-to-side difference in stock removal and change in workpiece side of greater material removal rate can be attributed to slurry flow redistribution due to accumulation of polishing debris in the polishing pads.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 248-253 |
| Number of pages | 6 |
| Journal | Journal of Materials Processing Technology |
| Volume | 109 |
| Issue number | 3 |
| DOIs | |
| State | Published - Feb 15 2001 |