Combined Reactive and Radiation Coupling of Conductors in an Enclosure - Numerical Validation of Stochastic Wavefield Model

W. Dai; P. G. Bremner; M. M. Mustafa; J. C. West; C. F. Bunting

doi:10.1109/EMCSIPI50001.2023.10241551

Combined Reactive and Radiation Coupling of Conductors in an Enclosure - Numerical Validation of Stochastic Wavefield Model

W. Dai
, P. G. Bremner
, M. M. Mustafa
, J. C. West
, C. F. Bunting

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Scopus citations

Abstract

A low-fidelity hybrid transmission line method- stochastic power flow (TLM-SPF) model has been developed to study the coupling of electromagnetic fields to conductors in an enclosure. Model setup time is approximately 10 minutes and computational time less than one minute. The resulting stochastic predictions agree with a high-fidelity full-wave simulation over a broad frequency range that requires days of computation on a high-performance computing system. This low-fidelity hybrid TLM - SPF approach is easily extendable to multi-segment cable harnesses in multi-cavity compartments. It is a computationally compact approach for a full system model of an aircraft, etc.

Original language	English (US)
Title of host publication	2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	171-176
Number of pages	6
ISBN (Electronic)	9798350309768
DOIs	https://doi.org/10.1109/EMCSIPI50001.2023.10241551
State	Published - 2023
Externally published	Yes
Event	2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023 - Grand Rapids, United States Duration: Jul 29 2023 → Aug 4 2023

Publication series

Name	2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023

Conference

Conference	2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023
Country/Territory	United States
City	Grand Rapids
Period	7/29/23 → 8/4/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

Keywords

stochastic power flow
transmission line

Publisher link

10.1109/EMCSIPI50001.2023.10241551

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Dai, W., Bremner, P. G., Mustafa, M. M., West, J. C., & Bunting, C. F. (2023). Combined Reactive and Radiation Coupling of Conductors in an Enclosure - Numerical Validation of Stochastic Wavefield Model. In 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023 (pp. 171-176). (2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMCSIPI50001.2023.10241551

Combined Reactive and Radiation Coupling of Conductors in an Enclosure - Numerical Validation of Stochastic Wavefield Model. / Dai, W.; Bremner, P. G.; Mustafa, M. M. et al.
2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 171-176 (2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Dai, W, Bremner, PG, Mustafa, MM, West, JC & Bunting, CF 2023, Combined Reactive and Radiation Coupling of Conductors in an Enclosure - Numerical Validation of Stochastic Wavefield Model. in 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023. 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, Institute of Electrical and Electronics Engineers Inc., pp. 171-176, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, Grand Rapids, United States, 7/29/23. https://doi.org/10.1109/EMCSIPI50001.2023.10241551

Dai W, Bremner PG, Mustafa MM, West JC, Bunting CF. Combined Reactive and Radiation Coupling of Conductors in an Enclosure - Numerical Validation of Stochastic Wavefield Model. In 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 171-176. (2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023). doi: 10.1109/EMCSIPI50001.2023.10241551

Dai, W. ; Bremner, P. G. ; Mustafa, M. M. et al. / Combined Reactive and Radiation Coupling of Conductors in an Enclosure - Numerical Validation of Stochastic Wavefield Model. 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 171-176 (2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023).

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Combined Reactive and Radiation Coupling of Conductors in an Enclosure - Numerical Validation of Stochastic Wavefield Model

Abstract

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Bibliographical note

Keywords

Publisher link

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