Abstract
Modification of a low-pressure CVD reactor and the similar deposition chemistries of Ti(NO3)4, Sn(NO3)4, and Hf(NO3)4 allowed the growth of films on silicon exhibiting a compositional spread of the respective metal dioxides. Electrical measurements of 100 x 100 μm capacitors (shown in the picture) suggest that the dielectric constant of the film can be estimated by a weighted average of the dielectric constants of the individual oxides.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 474-476 |
| Number of pages | 3 |
| Journal | Chemistry of Materials |
| Volume | 14 |
| Issue number | 2 |
| DOIs | |
| State | Published - 2002 |
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