Circuit and antenna-in-package innovations for scaled mmWave 5G phased array modules

Alberto Valdes-Garcia, Bodhisatwa Sadhu, Xiaoxiong Gu, Yahya Tousi, Duixian Liu, Scott K. Reynolds, Joakim Haillin, Stefan Sahl, Leonard Rexberg

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Scopus citations

Abstract

Directional communication at millimeter-wave (mmWave) frequencies is one of the key technologies under development towards the anticipated deployment of fifth generation mobile access (5G). Silicon-based multi-antenna systems are strong candidates for the implementation of such directional links; however, the performance requirements are in general significantly more challenging than those posed by mmWave WLAN links demonstrated so far (e.g. for 802.11ad). This work presents an overview of recent innovations in circuit design, antenna design, and beamforming architecture which enable complex phased arrays with precise and agile beamforming for mmWave-based 5G communications. Specifically, this work discusses: (1) a 28-GHz phase shifting transceiver front end, (2) beamforming architecture considerations to enable dual polarized operation as well as multi beam configurability, and (3) two different 28-GHz antenna-in-package (AiP) designs. These advances have been jointly demonstrated in a 64-element dual polarized phased array antenna module (PAAM) consisting of four SiGe ICs and an AiP array. The PAAM supports two simultaneous and independent 64-element beams in either TX or RX modes. PAAM-level measurement results over the air without calibration show +/- 50° beam scanning with >10dB silde-lobe rejection, <1.4° beam steering resolution with 0.6° RMS error, and 54 dBm saturated EIRP in each polarization. On-wafer measurement results from a front-end breakout and a full phased array IC are presented as well.

Original languageEnglish (US)
Title of host publication2018 IEEE Custom Integrated Circuits Conference, CICC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-8
Number of pages8
ISBN (Electronic)9781538624838
DOIs
StatePublished - May 9 2018
Externally publishedYes
Event2018 IEEE Custom Integrated Circuits Conference, CICC 2018 - San Diego, United States
Duration: Apr 8 2018Apr 11 2018

Publication series

Name2018 IEEE Custom Integrated Circuits Conference, CICC 2018

Other

Other2018 IEEE Custom Integrated Circuits Conference, CICC 2018
CountryUnited States
CitySan Diego
Period4/8/184/11/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

Copyright:
Copyright 2018 Elsevier B.V., All rights reserved.

Keywords

  • 28GHz
  • 5G
  • SiGe
  • dual polarization
  • mmWave
  • orthogonal phase and gain
  • phased array
  • transceiver

Fingerprint Dive into the research topics of 'Circuit and antenna-in-package innovations for scaled mmWave 5G phased array modules'. Together they form a unique fingerprint.

Cite this