Characterization of micromachined transitions for high-speed integrated packages

Rhonda Franklin Drayton, S. Riki Banerjee, Jeremy L. Haley

Research output: Contribution to journalArticlepeer-review

2 Scopus citations


Micromachined transitions are characterized with abrupt and taper dielectric and conductor discontinuities. Constant impedance designs are studied for interconnects printed on the same substrate that traverse two different substrate heights. The best transition, when compared to the constant height design, has better than 20 dB return loss over 40 GHz. Its effective dielectric constant variation is less than 0.25 dB across the bandwidth, which indicates a low dispersion interconnect design with a micromachined transition.

Original languageEnglish (US)
Pages (from-to)693-697
Number of pages5
JournalIEEE Transactions on Antennas and Propagation
Issue number5
StatePublished - May 2002

Bibliographical note

Funding Information:
Manuscript received July 26, 2001; revised January 18, 2002. This work was supported by the National Science Foundation’s Presidential Early Career Award for Scientists and Engineers Award ECS-9996017. The authors are with the Department of Electrical and Computer Engineering, University of Minnesota, 200 Union Street St. S.E., Minneapolis, MN 55455 USA (e-mail: Publisher Item Identifier S 0018-926X(02)05462-5.


  • Integrated circuit packaging
  • Micromachining
  • Microstrip transitions


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