TY - JOUR
T1 - Characterization of interconnect coupling noise using in-situ delay-change curve measurements
AU - Sato, Takashi
AU - Cao, Yu
AU - Sylvester, Dennis
AU - Hu, Chenming
PY - 2000
Y1 - 2000
N2 - The delay-change curve (DCC) characterizes the variation the interconnect delay due to coupling noise. This paper describes a set of novel models that relate the DCC to the coupling noise waveform. These models are targeted for use in the timing margin design and accurate experimental determination of sub-nanosecond coupling noise. The circuit structure, a set of measurements, the model equations, and the waveform extraction procedures are newly proposed. Evaluation results using a 0.25-μm test chip are presented showing good agreement with SPICE simulations.
AB - The delay-change curve (DCC) characterizes the variation the interconnect delay due to coupling noise. This paper describes a set of novel models that relate the DCC to the coupling noise waveform. These models are targeted for use in the timing margin design and accurate experimental determination of sub-nanosecond coupling noise. The circuit structure, a set of measurements, the model equations, and the waveform extraction procedures are newly proposed. Evaluation results using a 0.25-μm test chip are presented showing good agreement with SPICE simulations.
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M3 - Conference article
AN - SCOPUS:0033681236
SN - 1063-0988
SP - 321
EP - 325
JO - Proceedings of the Annual IEEE International ASIC Conference and Exhibit
JF - Proceedings of the Annual IEEE International ASIC Conference and Exhibit
T2 - Proceedings of the 13th Annual IEEE International ASIC/SOC Conference
Y2 - 13 September 2000 through 16 September 2000
ER -