Abstract
3D technology provides a number of challenges and opportunities to the designer. To leverage this technology fully, it is essential to develop compuer-aided design techniques that are 3D-specific. This paper discusses problems in the area of layout, thermal optimization, and power supply network design that are critical in the design of 3D chips.
| Original language | English (US) |
|---|---|
| Pages | 245-252 |
| Number of pages | 8 |
| State | Published - Dec 1 2007 |
| Event | 24th International VLSI Multilevel Interconnection Conference, VMIC 2007 - Fremont, CA, United States Duration: Sep 25 2007 → Sep 27 2007 |
Other
| Other | 24th International VLSI Multilevel Interconnection Conference, VMIC 2007 |
|---|---|
| Country/Territory | United States |
| City | Fremont, CA |
| Period | 9/25/07 → 9/27/07 |