3D technology provides a number of challenges and opportunities to the designer. To leverage this technology fully, it is essential to develop compuer-aided design techniques that are 3D-specific. This paper discusses problems in the area of layout, thermal optimization, and power supply network design that are critical in the design of 3D chips.
|Original language||English (US)|
|Number of pages||8|
|State||Published - Dec 1 2007|
|Event||24th International VLSI Multilevel Interconnection Conference, VMIC 2007 - Fremont, CA, United States|
Duration: Sep 25 2007 → Sep 27 2007
|Other||24th International VLSI Multilevel Interconnection Conference, VMIC 2007|
|Period||9/25/07 → 9/27/07|