TY - JOUR
T1 - Atomic layer deposition
T2 - A versatile technique for plasmonics and nanobiotechnology
AU - Im, Hyungsoon
AU - Wittenberg, Nathan J.
AU - Lindquist, Nathan C.
AU - Oh, Sang Hyun
PY - 2012/2/28
Y1 - 2012/2/28
N2 - Although atomic layer deposition (ALD) has been used for many years as an industrial manufacturing method for microprocessors and displays, this versatile technique is finding increased use in the emerging fields of plasmonics and nanobiotechnology. In particular, ALD coatings can modify metallic surfaces to tune their optical and plasmonic properties, to protect them against unwanted oxidation and contamination, or to create biocompatible surfaces. Furthermore, ALD is unique among thin film deposition techniques in its ability to meet the processing demands for engineering nanoplasmonic devices, offering conformal deposition of dense and ultrathin films on high-aspect-ratio nanostructures at temperatures below 100 °C. In this review, we present key features of ALD and describe how it could benefit future applications in plasmonics, nanosciences, and biotechnology.
AB - Although atomic layer deposition (ALD) has been used for many years as an industrial manufacturing method for microprocessors and displays, this versatile technique is finding increased use in the emerging fields of plasmonics and nanobiotechnology. In particular, ALD coatings can modify metallic surfaces to tune their optical and plasmonic properties, to protect them against unwanted oxidation and contamination, or to create biocompatible surfaces. Furthermore, ALD is unique among thin film deposition techniques in its ability to meet the processing demands for engineering nanoplasmonic devices, offering conformal deposition of dense and ultrathin films on high-aspect-ratio nanostructures at temperatures below 100 °C. In this review, we present key features of ALD and describe how it could benefit future applications in plasmonics, nanosciences, and biotechnology.
KW - Atomic layer deposition
KW - Nanostructure
KW - Sensor
UR - http://www.scopus.com/inward/record.url?scp=84857207702&partnerID=8YFLogxK
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U2 - 10.1557/jmr.2011.434
DO - 10.1557/jmr.2011.434
M3 - Review article
AN - SCOPUS:84857207702
SN - 0884-2914
VL - 27
SP - 663
EP - 671
JO - Journal of Materials Research
JF - Journal of Materials Research
IS - 4
ER -