Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films

Alan W.S. Ross; Coinneach M. Dover; Stewart Smith; Jonathan G. Terry; Andrew R. Mount; Anthony J. Walton

doi:10.1109/ICMTS50340.2022.9898250

Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films

Alan W.S. Ross, Coinneach M. Dover, Stewart Smith, Jonathan G. Terry, Andrew R. Mount, Anthony J. Walton

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents a previously documented full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. With magnetic films, non-magnetic seed layers need to be as thin as possible to minimise unwanted eddy currents. This paper uses the test structure to quantify the IR drop on the electroplated film and demonstrates how current distribution structures can be simply used to significantly improve wafer plating uniformity when using seed layer thicknesses of a few nanometers.

Original language	English (US)
Title of host publication	2022 IEEE 34th International Conference on Microelectronic Test Structures, ICMTS 2022 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781665485661
DOIs	https://doi.org/10.1109/ICMTS50340.2022.9898250
State	Published - 2022
Externally published	Yes
Event	34th IEEE International Conference on Microelectronic Test Structures, ICMTS 2022 - Cleveland, United States Duration: Mar 21 2022 → Apr 15 2022

Publication series

Name	2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)

Conference

Conference	34th IEEE International Conference on Microelectronic Test Structures, ICMTS 2022
Country/Territory	United States
City	Cleveland
Period	3/21/22 → 4/15/22

Bibliographical note

Publisher Copyright:
© 2022 IEEE.

Publisher link

10.1109/ICMTS50340.2022.9898250

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Ross, A. W. S., Dover, C. M., Smith, S., Terry, J. G., Mount, A. R., & Walton, A. J. (2022). Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films. In 2022 IEEE 34th International Conference on Microelectronic Test Structures, ICMTS 2022 - Proceedings (2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMTS50340.2022.9898250

Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films. / Ross, Alan W.S.; Dover, Coinneach M.; Smith, Stewart et al.
2022 IEEE 34th International Conference on Microelectronic Test Structures, ICMTS 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ross, AWS, Dover, CM, Smith, S, Terry, JG, Mount, AR & Walton, AJ 2022, Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films. in 2022 IEEE 34th International Conference on Microelectronic Test Structures, ICMTS 2022 - Proceedings. 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS), Institute of Electrical and Electronics Engineers Inc., 34th IEEE International Conference on Microelectronic Test Structures, ICMTS 2022, Cleveland, United States, 3/21/22. https://doi.org/10.1109/ICMTS50340.2022.9898250

Ross AWS, Dover CM, Smith S, Terry JG, Mount AR, Walton AJ. Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films. In 2022 IEEE 34th International Conference on Microelectronic Test Structures, ICMTS 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2022. (2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)). doi: 10.1109/ICMTS50340.2022.9898250

Ross, Alan W.S. ; Dover, Coinneach M. ; Smith, Stewart et al. / Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films. 2022 IEEE 34th International Conference on Microelectronic Test Structures, ICMTS 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)).

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abstract = "This paper presents a previously documented full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. With magnetic films, non-magnetic seed layers need to be as thin as possible to minimise unwanted eddy currents. This paper uses the test structure to quantify the IR drop on the electroplated film and demonstrates how current distribution structures can be simply used to significantly improve wafer plating uniformity when using seed layer thicknesses of a few nanometers.",

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AU - Mount, Andrew R.

AU - Walton, Anthony J.

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AB - This paper presents a previously documented full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. With magnetic films, non-magnetic seed layers need to be as thin as possible to minimise unwanted eddy currents. This paper uses the test structure to quantify the IR drop on the electroplated film and demonstrates how current distribution structures can be simply used to significantly improve wafer plating uniformity when using seed layer thicknesses of a few nanometers.

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Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films

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