Abstract
In FinFET nodes, high transistor power densities in a power amplifier (PA) lead to device self-heating (SH), degrading performance. This study investigates the impact of SH in large PA FinFET arrays. An encoder-decoder network, together with a long short-term memory model, is used for rapid and accurate thermal analysis. This fast analyzer helps better explore design optimizations than conventional computationally-expensive thermal solvers. The work explores methods for mitigating thermal effects in PAs by inserting dummy transistors within the array of active FinFET devices, and shows the impact of duty cycle and frequency on PA performance.
Original language | English (US) |
---|---|
Title of host publication | Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2024 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9798400710773 |
DOIs | |
State | Published - Apr 9 2025 |
Event | 43rd International Conference on Computer-Aided Design, ICCAD 2024 - New York, United States Duration: Oct 27 2024 → Oct 31 2024 |
Publication series
Name | IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD |
---|---|
ISSN (Print) | 1092-3152 |
Conference
Conference | 43rd International Conference on Computer-Aided Design, ICCAD 2024 |
---|---|
Country/Territory | United States |
City | New York |
Period | 10/27/24 → 10/31/24 |
Bibliographical note
Publisher Copyright:© 2024 Copyright is held by the owner/author(s).