Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections

Mohammad Abdullah Al Shohel, Vidya A. Chhabria, Nestor Evmorfopoulos, Sachin S. Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Scopus citations

Abstract

Traditional methods that test for electromigration (EM) failure in multisegment interconnects, over the lifespan of an IC, are based on the use of the Blech criterion, followed by Black’s equation. Such methods analyze each segment independently, but are well known to be inaccurate due to stress buildup over multiple segments. This paper introduces the new concept of boundary reflections of stress flow that ascribes a physical (wave-like) interpretation to the transient stress behavior in a finite multisegment line. This can provide a framework for deriving analytical expressions of transient EM stress for lines with any number of segments, which can also be tailored to include the appropriate number of terms for any desired level of accuracy. The proposed method is shown to have excellent accuracy, through evaluations against the FEM solver COMSOL, as well as scalability, through its application on large power grid benchmarks.

Original languageEnglish (US)
Title of host publication2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665445078
DOIs
StatePublished - 2021
Event40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Munich, Germany
Duration: Nov 1 2021Nov 4 2021

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
Volume2021-November
ISSN (Print)1092-3152

Conference

Conference40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021
Country/TerritoryGermany
CityMunich
Period11/1/2111/4/21

Bibliographical note

Funding Information:
This work was supported in part by the NSF under award CCF-1714805 and by the DARPA IDEA program, and by the Louise Dosdall Fellowship. The work of the third author was supported in part by a Scholar grant from the Fulbright Foundation, Greece.

Publisher Copyright:
© 2021 IEEE.

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