Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections

Mohammad Abdullah Al Shohel; Vidya A. Chhabria; Nestor Evmorfopoulos; Sachin S. Sapatnekar

doi:10.1109/ICCAD51958.2021.9643570

Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections

Mohammad Abdullah Al Shohel, Vidya A. Chhabria, Nestor Evmorfopoulos, Sachin S. Sapatnekar

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

18 Scopus citations

Abstract

Traditional methods that test for electromigration (EM) failure in multisegment interconnects, over the lifespan of an IC, are based on the use of the Blech criterion, followed by Black’s equation. Such methods analyze each segment independently, but are well known to be inaccurate due to stress buildup over multiple segments. This paper introduces the new concept of boundary reflections of stress flow that ascribes a physical (wave-like) interpretation to the transient stress behavior in a finite multisegment line. This can provide a framework for deriving analytical expressions of transient EM stress for lines with any number of segments, which can also be tailored to include the appropriate number of terms for any desired level of accuracy. The proposed method is shown to have excellent accuracy, through evaluations against the FEM solver COMSOL, as well as scalability, through its application on large power grid benchmarks.

Original language	English (US)
Title of host publication	2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781665445078
DOIs	https://doi.org/10.1109/ICCAD51958.2021.9643570
State	Published - 2021
Event	40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Munich, Germany Duration: Nov 1 2021 → Nov 4 2021

Publication series

Name	IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
Volume	2021-November
ISSN (Print)	1092-3152

Conference

Conference	40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021
Country/Territory	Germany
City	Munich
Period	11/1/21 → 11/4/21

Bibliographical note

Funding Information:
This work was supported in part by the NSF under award CCF-1714805 and by the DARPA IDEA program, and by the Louise Dosdall Fellowship. The work of the third author was supported in part by a Scholar grant from the Fulbright Foundation, Greece.

Publisher Copyright:
© 2021 IEEE.

Publisher link

10.1109/ICCAD51958.2021.9643570

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Al Shohel, M. A., Chhabria, V. A., Evmorfopoulos, N., & Sapatnekar, S. S. (2021). Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections. In 2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD; Vol. 2021-November). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCAD51958.2021.9643570

Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections. / Al Shohel, Mohammad Abdullah; Chhabria, Vidya A.; Evmorfopoulos, Nestor et al.
2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2021. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD; Vol. 2021-November).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Al Shohel, MA, Chhabria, VA, Evmorfopoulos, N & Sapatnekar, SS 2021, Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections. in 2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings. IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD, vol. 2021-November, Institute of Electrical and Electronics Engineers Inc., 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021, Munich, Germany, 11/1/21. https://doi.org/10.1109/ICCAD51958.2021.9643570

Al Shohel MA, Chhabria VA, Evmorfopoulos N, Sapatnekar SS. Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections. In 2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2021. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). doi: 10.1109/ICCAD51958.2021.9643570

Al Shohel, Mohammad Abdullah ; Chhabria, Vidya A. ; Evmorfopoulos, Nestor et al. / Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections. 2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2021. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

@inproceedings{488c9012cb5d43c296deae7967de835d,

title = "Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections",

abstract = "Traditional methods that test for electromigration (EM) failure in multisegment interconnects, over the lifespan of an IC, are based on the use of the Blech criterion, followed by Black{\textquoteright}s equation. Such methods analyze each segment independently, but are well known to be inaccurate due to stress buildup over multiple segments. This paper introduces the new concept of boundary reflections of stress flow that ascribes a physical (wave-like) interpretation to the transient stress behavior in a finite multisegment line. This can provide a framework for deriving analytical expressions of transient EM stress for lines with any number of segments, which can also be tailored to include the appropriate number of terms for any desired level of accuracy. The proposed method is shown to have excellent accuracy, through evaluations against the FEM solver COMSOL, as well as scalability, through its application on large power grid benchmarks.",

author = "{Al Shohel}, {Mohammad Abdullah} and Chhabria, {Vidya A.} and Nestor Evmorfopoulos and Sapatnekar, {Sachin S.}",

note = "Funding Information: This work was supported in part by the NSF under award CCF-1714805 and by the DARPA IDEA program, and by the Louise Dosdall Fellowship. The work of the third author was supported in part by a Scholar grant from the Fulbright Foundation, Greece. Publisher Copyright: {\textcopyright} 2021 IEEE.; 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 ; Conference date: 01-11-2021 Through 04-11-2021",

year = "2021",

doi = "10.1109/ICCAD51958.2021.9643570",

language = "English (US)",

series = "IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings",

}

TY - GEN

T1 - Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections

AU - Al Shohel, Mohammad Abdullah

AU - Chhabria, Vidya A.

AU - Evmorfopoulos, Nestor

AU - Sapatnekar, Sachin S.

N1 - Funding Information: This work was supported in part by the NSF under award CCF-1714805 and by the DARPA IDEA program, and by the Louise Dosdall Fellowship. The work of the third author was supported in part by a Scholar grant from the Fulbright Foundation, Greece. Publisher Copyright: © 2021 IEEE.

PY - 2021

Y1 - 2021

N2 - Traditional methods that test for electromigration (EM) failure in multisegment interconnects, over the lifespan of an IC, are based on the use of the Blech criterion, followed by Black’s equation. Such methods analyze each segment independently, but are well known to be inaccurate due to stress buildup over multiple segments. This paper introduces the new concept of boundary reflections of stress flow that ascribes a physical (wave-like) interpretation to the transient stress behavior in a finite multisegment line. This can provide a framework for deriving analytical expressions of transient EM stress for lines with any number of segments, which can also be tailored to include the appropriate number of terms for any desired level of accuracy. The proposed method is shown to have excellent accuracy, through evaluations against the FEM solver COMSOL, as well as scalability, through its application on large power grid benchmarks.

AB - Traditional methods that test for electromigration (EM) failure in multisegment interconnects, over the lifespan of an IC, are based on the use of the Blech criterion, followed by Black’s equation. Such methods analyze each segment independently, but are well known to be inaccurate due to stress buildup over multiple segments. This paper introduces the new concept of boundary reflections of stress flow that ascribes a physical (wave-like) interpretation to the transient stress behavior in a finite multisegment line. This can provide a framework for deriving analytical expressions of transient EM stress for lines with any number of segments, which can also be tailored to include the appropriate number of terms for any desired level of accuracy. The proposed method is shown to have excellent accuracy, through evaluations against the FEM solver COMSOL, as well as scalability, through its application on large power grid benchmarks.

UR - http://www.scopus.com/inward/record.url?scp=85122116658&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85122116658&partnerID=8YFLogxK

U2 - 10.1109/ICCAD51958.2021.9643570

DO - 10.1109/ICCAD51958.2021.9643570

M3 - Conference contribution

AN - SCOPUS:85122116658

T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

BT - 2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021

Y2 - 1 November 2021 through 4 November 2021

ER -

Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections

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