Analysis and experimental validation of a modular multilevel converter with 3-level T-type submodules

Ashish Kumar Sahoo, Ned Mohan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Modular multilevel converters (MMC) have become an attractive solution for high voltage direct current (HVDC) transmission applications due to its scalability, reliability and easy maintenance. Considerable work has been around the conventional 2-level half-bridge submodule. Use of multilevel submodules can result in smaller overall footprint, reduced components and lower losses. This paper presents the analysis and experimental validation of a MMC based HVDC system using 3-level T-type submodule. A hybrid modulation scheme, modified voltage balancing algorithm and circulating current control is presented. For practical implementation, an intelligent commutation technique is proposed that results in 66% of the switching transitions to be soft switched. The working principle is validated by simulations in MATLAB/Simulink and experimental results on a scaled down laboratory prototype.

Original languageEnglish (US)
Title of host publication2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1865-1872
Number of pages8
ISBN (Electronic)9781509053667
DOIs
StatePublished - May 17 2017
Event32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 - Tampa, United States
Duration: Mar 26 2017Mar 30 2017

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Other

Other32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017
CountryUnited States
CityTampa
Period3/26/173/30/17

Keywords

  • Circulating current control
  • Commutation
  • Highvoltage direct current (HVDC) transmission
  • Modular multilevel converter (MMC)
  • Pulse-width modulation (PWM)

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    Sahoo, A. K., & Mohan, N. (2017). Analysis and experimental validation of a modular multilevel converter with 3-level T-type submodules. In 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017 (pp. 1865-1872). [7930952] (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEC.2017.7930952