TY - GEN
T1 - An ultra-dense irradiation test structure with a NAND/NOR readout chain for characterizing soft error rates of 14nm combinational logic circuits
AU - Kumar, Saurabh
AU - Cho, Minki
AU - Everson, Luke
AU - Kim, Hoonki
AU - Tang, Qianying
AU - Mazanec, Paul
AU - Meinerzhagen, Pascal
AU - Malavasi, Andres
AU - Lake, Dan
AU - Tokunaga, Carlos
AU - Khellah, Muhammad
AU - Tschanz, James
AU - Borkar, Shekhar
AU - De, Vivek
AU - Kim, Chris H.
PY - 2018/1/23
Y1 - 2018/1/23
N2 - This paper describes a 14nm test chip employing a novel NAND/NOR readout chain for characterizing soft error rate (SER) in combinational logic gates. The proposed test structure uses high density standard logic gates as detection circuit for sensing Single Event Transients (SETs) that are then forwarded to a skewed NAND-NOR readout chain which funnels all SET pulses while expanding the pulse width to ensure they reach the final triple modular redundant (TMR) counter. The proposed circuit is compact, has a scalable architecture based on a unit cell layout, and incurs minimal area overhead. Different gate configurations (device size, threshold voltage, fan-out and chain length) were implemented in the 14nm test-chip and irradiated under a neutron beam to collect a massive amount of statistical data. Radiation data captures, for the first time, the impact of various circuit parameters on combinational logic SER in 14nm tri-gate technology.
AB - This paper describes a 14nm test chip employing a novel NAND/NOR readout chain for characterizing soft error rate (SER) in combinational logic gates. The proposed test structure uses high density standard logic gates as detection circuit for sensing Single Event Transients (SETs) that are then forwarded to a skewed NAND-NOR readout chain which funnels all SET pulses while expanding the pulse width to ensure they reach the final triple modular redundant (TMR) counter. The proposed circuit is compact, has a scalable architecture based on a unit cell layout, and incurs minimal area overhead. Different gate configurations (device size, threshold voltage, fan-out and chain length) were implemented in the 14nm test-chip and irradiated under a neutron beam to collect a massive amount of statistical data. Radiation data captures, for the first time, the impact of various circuit parameters on combinational logic SER in 14nm tri-gate technology.
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U2 - 10.1109/IEDM.2017.8268521
DO - 10.1109/IEDM.2017.8268521
M3 - Conference contribution
AN - SCOPUS:85045200626
T3 - Technical Digest - International Electron Devices Meeting, IEDM
SP - 39.3.1-39.3.4
BT - 2017 IEEE International Electron Devices Meeting, IEDM 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 63rd IEEE International Electron Devices Meeting, IEDM 2017
Y2 - 2 December 2017 through 6 December 2017
ER -