An overview of advances in heat conduction models and approaches for prediction of thermal conductivity in thin dielectric films

Christianne V.D.R. Anderson, Kumar K. Tamma

Research output: Contribution to journalArticlepeer-review

19 Scopus citations

Abstract

We first provide an overview of some predominant theoretical methods currently used for predicting thermal conductivity of thin dielectric films: the equation of radiative transfer, the temperature-dependent thermal conductivity theories based on the Callaway model, and the molecular dynamics simulation. This overview also highlights temporal and spatial scale issues by looking at a unified theory that bridges physical issues presented in the Fourier and Cattaneo models. This newly developed unified theory is the so-called C- and F-processes constitutive models. This model introduces the notion of a new dimensionless heat conduction model number, which is the ratio of the thermal conductivity of the fast heat carrier F-processes to the total thermal conductivity comprised of both the fast heat carriers F-processes and the slow heat carriers C-processes. Illustrative numerical examples for prediction of thermal conductivity in thin films are primarily presented.

Original languageEnglish (US)
Pages (from-to)12-65
Number of pages54
JournalInternational Journal of Numerical Methods for Heat and Fluid Flow
Volume14
Issue number1
DOIs
StatePublished - Feb 18 2004

Keywords

  • Dielectric properties
  • Heat conduction
  • Thermal conductivity

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