TY - JOUR
T1 - An overview of advances in heat conduction models and approaches for prediction of thermal conductivity in thin dielectric films
AU - Anderson, Christianne V.D.R.
AU - Tamma, Kumar K.
PY - 2004
Y1 - 2004
N2 - We first provide an overview of some predominant theoretical methods currently used for predicting thermal conductivity of thin dielectric films: the equation of radiative transfer, the temperature-dependent thermal conductivity theories based on the Callaway model, and the molecular dynamics simulation. This overview also highlights temporal and spatial scale issues by looking at a unified theory that bridges physical issues presented in the Fourier and Cattaneo models. This newly developed unified theory is the so-called C- and F-processes constitutive models. This model introduces the notion of a new dimensionless heat conduction model number, which is the ratio of the thermal conductivity of the fast heat carrier F-processes to the total thermal conductivity comprised of both the fast heat carriers F-processes and the slow heat carriers C-processes. Illustrative numerical examples for prediction of thermal conductivity in thin films are primarily presented.
AB - We first provide an overview of some predominant theoretical methods currently used for predicting thermal conductivity of thin dielectric films: the equation of radiative transfer, the temperature-dependent thermal conductivity theories based on the Callaway model, and the molecular dynamics simulation. This overview also highlights temporal and spatial scale issues by looking at a unified theory that bridges physical issues presented in the Fourier and Cattaneo models. This newly developed unified theory is the so-called C- and F-processes constitutive models. This model introduces the notion of a new dimensionless heat conduction model number, which is the ratio of the thermal conductivity of the fast heat carrier F-processes to the total thermal conductivity comprised of both the fast heat carriers F-processes and the slow heat carriers C-processes. Illustrative numerical examples for prediction of thermal conductivity in thin films are primarily presented.
KW - Dielectric properties
KW - Heat conduction
KW - Thermal conductivity
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U2 - 10.1108/09615530410511621
DO - 10.1108/09615530410511621
M3 - Article
AN - SCOPUS:0842348175
SN - 0961-5539
VL - 14
SP - 12
EP - 65
JO - International Journal of Numerical Methods for Heat and Fluid Flow
JF - International Journal of Numerical Methods for Heat and Fluid Flow
IS - 1
ER -