An experimental fracture mechanics study of a strong interface: The silicon/glass anodic bond

Keyphrases

• Bonding Temperature 100%
• Anodic 100%
• Silicon-on-glass 100%
• Strong Interface 100%
• Experimental Fracture Mechanics 100%
• Near-interface 60%
• Linear Elastic 40%
• Interfacial Crack 40%
• Sodium Depletion 40%
• Kink Angle 40%
• Compressive Residual Stress 40%
• Fracture Mechanics 20%
• Toughness 20%
• Stress-induced 20%
• Chevron 20%
• Room Temperature 20%
• Depletion Region 20%
• Shear Stress 20%
• Load Test 20%
• Fracture Behavior 20%
• Crack Tip 20%
• Kink 20%
• Profilometry 20%
• Young's Modulus 20%
• Bi-material 20%
• Maximum Load 20%
• Thermal Mismatch 20%
• Interface Region 20%
• Stress Magnitude 20%
• Crack-tip Shielding 20%
• Tensile Loading 20%
• Interface Planes 20%
• Differential Thermal 20%
• Compact Tension Specimen 20%
• Pyrex Glass 20%
• Plane Strain Fracture Toughness 20%
• Thermal Contraction 20%
• XPS Measurements 20%
• High Bonding Strength 20%
• Fracture Toughness Evaluation 20%
• Stress Increase 20%
• Fracture Toughness Value 20%

Material Science

• Silicon 100%
• Fracture Mechanics 100%
• Crack Tip 100%
• Fracture Toughness 100%
• Residual Stress 100%
• Sodium 100%
• Young's Modulus 50%
• Fracture Behavior 50%
• Load Testing 50%