Abstract
As we approach the limits of CMOS scaling, researchers are developing "beyond-CMOS" technologies to sustain the technological benefits associated with device scaling. Spin-tronic technologies have emerged as a promising beyond-CMOS technology due to their inherent benefits over CMOS such as high integration density, low leakage power, radiation hardness, and non-volatility. These benefits make spintronic devices an attractive successor to CMOS - especially for memory circuits. However, spintronic devices generally suffer from slower switching speeds and higher write energy, which limits their usability. In an effort to close the energy-delay gap between CMOS and spintronics, device concepts such as CoMET (Composite-Input Magnetoelectric-base Logic Technology) have been introduced, which collectively leverage material phenomena such as the spin-Hall effect and the magnetoelectric effect to enable fast, energy efficient device operation. In this work, we propose a non-volatile flip-flop (NVFF) based on CoMET technology that is capable of achieving up to two orders of magnitude less write energy than CMOS. This low write energy (≈2 aJ) makes our CoMET NVFF especially attractive to architectures that require frequent backup operations - e.g., for energy harvesting non-volatile processors.
| Original language | English (US) |
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| Title of host publication | Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 390-395 |
| Number of pages | 6 |
| ISBN (Electronic) | 9783981926323 |
| DOIs | |
| State | Published - May 14 2019 |
| Event | 22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 - Florence, Italy Duration: Mar 25 2019 → Mar 29 2019 |
Publication series
| Name | Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 |
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Conference
| Conference | 22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 |
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| Country/Territory | Italy |
| City | Florence |
| Period | 3/25/19 → 3/29/19 |
Bibliographical note
Funding Information:ACKNOWLEDGMENT This work was supported in part by ASCENT, one of six centers in JUMP, a Semiconductor Research Corporation (SRC) program sponsored by DARPA. This work was supported in part by C-SPIN, one of six centers of STARnet, a Semiconductor Research Corporation program, sponsored by MARCO and DARPA.
Publisher Copyright:
© 2019 EDAA.