An Energy Efficient Non-Volatile Flip-Flop based on CoMET Technology

Robert Perricone, Zhaoxin Liang, Meghna G. Mankalale, Michael Niemier, Sachin S. Sapatnekar, Jian Ping Wang, X. Sharon Hu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

As we approach the limits of CMOS scaling, researchers are developing "beyond-CMOS" technologies to sustain the technological benefits associated with device scaling. Spin-tronic technologies have emerged as a promising beyond-CMOS technology due to their inherent benefits over CMOS such as high integration density, low leakage power, radiation hardness, and non-volatility. These benefits make spintronic devices an attractive successor to CMOS - especially for memory circuits. However, spintronic devices generally suffer from slower switching speeds and higher write energy, which limits their usability. In an effort to close the energy-delay gap between CMOS and spintronics, device concepts such as CoMET (Composite-Input Magnetoelectric-base Logic Technology) have been introduced, which collectively leverage material phenomena such as the spin-Hall effect and the magnetoelectric effect to enable fast, energy efficient device operation. In this work, we propose a non-volatile flip-flop (NVFF) based on CoMET technology that is capable of achieving up to two orders of magnitude less write energy than CMOS. This low write energy (≈2 aJ) makes our CoMET NVFF especially attractive to architectures that require frequent backup operations - e.g., for energy harvesting non-volatile processors.

Original languageEnglish (US)
Title of host publicationProceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages390-395
Number of pages6
ISBN (Electronic)9783981926323
DOIs
StatePublished - May 14 2019
Event22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 - Florence, Italy
Duration: Mar 25 2019Mar 29 2019

Publication series

NameProceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019

Conference

Conference22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
Country/TerritoryItaly
CityFlorence
Period3/25/193/29/19

Bibliographical note

Funding Information:
ACKNOWLEDGMENT This work was supported in part by ASCENT, one of six centers in JUMP, a Semiconductor Research Corporation (SRC) program sponsored by DARPA. This work was supported in part by C-SPIN, one of six centers of STARnet, a Semiconductor Research Corporation program, sponsored by MARCO and DARPA.

Publisher Copyright:
© 2019 EDAA.

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