Abstract
In recent years, atomistic simulations are assuming a guiding role in the effort of optimizing the properties of advanced coating materials (Lawson et al., J Appl Phys 110:083507, 2011; Kindlund et al., APL Mater 1:042104, 2013; Tang et al., J Phys Chem C 119:24649–24656, 2015; Zhang et al., Surf Coat Technol 277:136–143, 2015; Ni et al., Appl Phys Lett 107:031603, 2015). In amorphous Silicon-Boron-Nitride networks (a-Si-B-N), understanding the role played by composition is of great importance for the future design of this new material. So far, a-Si-B-N structures have been explored to understand the impact of the BN:Si3N4 ratio onto mechanical properties (Tang et al., Chem Eur J 16:6458–6462, 2010; Schön et al., Process Appl Ceram 5:49–61, 2011; Griebel and Hamaekers, Comput Mater Sci 39:502–517, 2007; Ge et al., Adv Appl Ceram 113:367–371, 2014). Using classical molecular dynamics (MD) simulations, Griebel and Hamaekers (Comput Mater Sci 39:502–517, 2007) derived strain-stress curves of selected a-Si3BN5, a-Si3B2N6, and a-Si3B3N7 models and found that increasing the B content increases Young’s modulus. In this chapter, we extend the scope of the previous studies by revealing how composition and structure might influence a combination of properties desirable for coating applications. Using a combination of atomistic numerical methods, we screen a library of low enthalpy a-Si-B-N networks (a-Si3BN5, a-Si3B3N7, and a-Si3B9N13) to predict from extensive atomistic simulations the thermal conductivity (κ) and mechanical stiffness with different BN contents.
Original language | English (US) |
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Title of host publication | SpringerBriefs in Applied Sciences and Technology |
Publisher | Springer Verlag |
Pages | 41-53 |
Number of pages | 13 |
Edition | 9783319738819 |
DOIs | |
State | Published - 2018 |
Publication series
Name | SpringerBriefs in Applied Sciences and Technology |
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Number | 9783319738819 |
ISSN (Print) | 2191-530X |
ISSN (Electronic) | 2191-5318 |
Bibliographical note
Publisher Copyright:© 2018, The Author(s).