Advanced monolithic packaging concepts for high performance circuits and antennas

Rhonda F. Drayton, Rashaunda M. Henderson, Linda P B Katehi

Research output: Contribution to journalConference article

5 Scopus citations

Abstract

Unwanted electromagnetic coupling between neighboring elements is a common problem in high frequency planar circuits. This paper reports on the elimination of crosstalk in planar circuits using conformal micromachined packaging. In the 5 to 30 GHz range, a back-to-back right-angle bend in microstrip has cross-coupling as high as -20 dB. The use of monolithic packaging concepts reduces this coupling by as much as 20-30 dB down to the noise level of the measurement system.

Original languageEnglish (US)
Pages (from-to)1615-1618
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume3
StatePublished - Jan 1 1996
EventProceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA
Duration: Jun 17 1996Jun 21 1996

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