Unwanted electromagnetic coupling between neighboring elements is a common problem in high frequency planar circuits. This paper reports on the elimination of crosstalk in planar circuits using conformal micromachined packaging. In the 5 to 30 GHz range, a back-to-back right-angle bend in microstrip has cross-coupling as high as -20 dB. The use of monolithic packaging concepts reduces this coupling by as much as 20-30 dB down to the noise level of the measurement system.
|Original language||English (US)|
|Number of pages||4|
|Journal||IEEE MTT-S International Microwave Symposium Digest|
|State||Published - Jan 1 1996|
|Event||Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA|
Duration: Jun 17 1996 → Jun 21 1996