Abstract
Unwanted electromagnetic coupling between neighboring elements is a common problem in high frequency planar circuits. This paper reports on the elimination of crosstalk in planar circuits using conformal micromachined packaging. In the 5 to 30 GHz range, a back-to-back right-angle bend in microstrip has cross-coupling as high as -20 dB. The use of monolithic packaging concepts reduces this coupling by as much as 20-30 dB down to the noise level of the measurement system.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1615-1618 |
| Number of pages | 4 |
| Journal | IEEE MTT-S International Microwave Symposium Digest |
| Volume | 3 |
| State | Published - 1996 |
| Event | Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA Duration: Jun 17 1996 → Jun 21 1996 |