Advanced monolithic packaging concepts for high performance circuits and antennas

Rhonda F. Drayton, Rashaunda M. Henderson, Linda P B Katehi

Research output: Contribution to journalConference articlepeer-review

5 Scopus citations


Unwanted electromagnetic coupling between neighboring elements is a common problem in high frequency planar circuits. This paper reports on the elimination of crosstalk in planar circuits using conformal micromachined packaging. In the 5 to 30 GHz range, a back-to-back right-angle bend in microstrip has cross-coupling as high as -20 dB. The use of monolithic packaging concepts reduces this coupling by as much as 20-30 dB down to the noise level of the measurement system.

Original languageEnglish (US)
Pages (from-to)1615-1618
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
StatePublished - 1996
EventProceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA
Duration: Jun 17 1996Jun 21 1996


Dive into the research topics of 'Advanced monolithic packaging concepts for high performance circuits and antennas'. Together they form a unique fingerprint.

Cite this