Advanced laminated antiferromagnetically coupled media with high thermal stability and low noise

S. I. Pang; S. N. Piramanayagam; L. Huang; J. P. Wang

Advanced laminated antiferromagnetically coupled media with high thermal stability and low noise

S. I. Pang, S. N. Piramanayagam, L. Huang, J. P. Wang

Electrical and Computer Engineering

Research output: Contribution to conference › Abstract › peer-review

Abstract

Advanced laminated antiferromagnetically coupled media with high thermal stability and low noise was presented. Advantages of high thermal stability and low noise were achieved by incorporation of a thin top stabilizing layer. This thin layer was useful in pushing the areal density to a higher limit. It was observed that the switching field of the main magnetic layer increased and the thermal stability factor increased with increased thickness.

Original language	English (US)
State	Published - 2002
Event	2002 IEEE International Magnetics Conference-2002 IEEE INTERMAG - Amsterdam, Netherlands Duration: Apr 28 2002 → May 2 2002

Other

Other	2002 IEEE International Magnetics Conference-2002 IEEE INTERMAG
Country/Territory	Netherlands
City	Amsterdam
Period	4/28/02 → 5/2/02

Find It

Find It at U of M Libraries

Cite this

@conference{382033b694f24e3ab02d450da4c2f9e6,

title = "Advanced laminated antiferromagnetically coupled media with high thermal stability and low noise",

abstract = "Advanced laminated antiferromagnetically coupled media with high thermal stability and low noise was presented. Advantages of high thermal stability and low noise were achieved by incorporation of a thin top stabilizing layer. This thin layer was useful in pushing the areal density to a higher limit. It was observed that the switching field of the main magnetic layer increased and the thermal stability factor increased with increased thickness.",

author = "Pang, {S. I.} and Piramanayagam, {S. N.} and L. Huang and Wang, {J. P.}",

year = "2002",

language = "English (US)",

note = "2002 IEEE International Magnetics Conference-2002 IEEE INTERMAG ; Conference date: 28-04-2002 Through 02-05-2002",

}

TY - CONF

T1 - Advanced laminated antiferromagnetically coupled media with high thermal stability and low noise

AU - Pang, S. I.

AU - Piramanayagam, S. N.

AU - Huang, L.

AU - Wang, J. P.

PY - 2002

Y1 - 2002

N2 - Advanced laminated antiferromagnetically coupled media with high thermal stability and low noise was presented. Advantages of high thermal stability and low noise were achieved by incorporation of a thin top stabilizing layer. This thin layer was useful in pushing the areal density to a higher limit. It was observed that the switching field of the main magnetic layer increased and the thermal stability factor increased with increased thickness.

AB - Advanced laminated antiferromagnetically coupled media with high thermal stability and low noise was presented. Advantages of high thermal stability and low noise were achieved by incorporation of a thin top stabilizing layer. This thin layer was useful in pushing the areal density to a higher limit. It was observed that the switching field of the main magnetic layer increased and the thermal stability factor increased with increased thickness.

UR - http://www.scopus.com/inward/record.url?scp=18144444662&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=18144444662&partnerID=8YFLogxK

M3 - Abstract

AN - SCOPUS:18144444662

T2 - 2002 IEEE International Magnetics Conference-2002 IEEE INTERMAG

Y2 - 28 April 2002 through 2 May 2002

ER -

Advanced laminated antiferromagnetically coupled media with high thermal stability and low noise

Abstract

Other

Find It

Other files and links

Fingerprint

Cite this