TY - GEN
T1 - Advanced FOUP purge using diffusers for FOUP door-off application
AU - Wang, H. P.
AU - Kim, S. C.
AU - Liu, B.
PY - 2014/1/1
Y1 - 2014/1/1
N2 - In a number of key IC fabrication steps in-process wafers are sensitive to moisture, oxygen and other airborne molecular contaminants in the air. Nitrogen purge of closed Front Opening Unified Pods (FOUP) have been implemented in many fabs to minimize wafer's exposure to the contaminants (or CDA purge if oxygen is not of concern). As the technology node advances, the need for minimizing the exposure has become even more stringent and in some processes requires FOUP purge while the FOUP door is off on an EFEM loadport. This requirement brings unique challenges to FOUP purge, especially at the front locations near FOUP opening, where EFEM air constantly tries to enter the FOUP. In this paper we present Entegris' latest experimental study on understanding the unique challenges of FOUP door-off purge and the excellent test results of newly designed advanced FOUP with purge flow distribution manifolds (diffusers).
AB - In a number of key IC fabrication steps in-process wafers are sensitive to moisture, oxygen and other airborne molecular contaminants in the air. Nitrogen purge of closed Front Opening Unified Pods (FOUP) have been implemented in many fabs to minimize wafer's exposure to the contaminants (or CDA purge if oxygen is not of concern). As the technology node advances, the need for minimizing the exposure has become even more stringent and in some processes requires FOUP purge while the FOUP door is off on an EFEM loadport. This requirement brings unique challenges to FOUP purge, especially at the front locations near FOUP opening, where EFEM air constantly tries to enter the FOUP. In this paper we present Entegris' latest experimental study on understanding the unique challenges of FOUP door-off purge and the excellent test results of newly designed advanced FOUP with purge flow distribution manifolds (diffusers).
UR - http://www.scopus.com/inward/record.url?scp=84904676997&partnerID=8YFLogxK
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U2 - 10.1109/ASMC.2014.6846999
DO - 10.1109/ASMC.2014.6846999
M3 - Conference contribution
AN - SCOPUS:84904676997
SN - 9781479939442
T3 - ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings
SP - 120
EP - 124
BT - 25th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 25th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2014
Y2 - 19 May 2014 through 21 May 2014
ER -