Adhesion strength of Cu/polyimide measured by continuous micro-wedge scratch test

F. Wang, J. C. Nelson, H. Huang, M. de Boer, William W Gerberich, R. L. Swisher

Research output: Chapter in Book/Report/Conference proceedingConference contribution


A modified form of nanoscratch test, continuous micro-wedge scratch technique was applied to characterize the adhesion strength of 0.2 μm thick, 10 μm width sputtered copper fine lines on 50 μm thick solid PMDA-ODA polyimide films. A 20 μm width wedge-shaped diamond tip was used to mechanically debond Cu fine lines to polyimide substrate. Using a microindenter under control depth testing mode, critical loads for delaminations were obtained. The scratch morphology and the debonded areas were observed by scanning electron microscopy. The scratch test results by conical-shaped tip on plain films are also presented here and are compared to the results by wedge-shaped tip in fine metal lines. Practical work of adhesion of 4.1 J/m2 was calculated by FEM based on biomaterial fracture mechanism.

Original languageEnglish (US)
Title of host publicationInterface Control of Electrical, Chemical, and Mechanical Properties
EditorsPeter Borgesen, Klavs F. Jensen, Roger A. Pollak
PublisherPubl by Materials Research Society
Number of pages6
ISBN (Print)1558992170
StatePublished - 1994
EventProceedings of the Fall 1993 MRS Meeting - Boston, MA, USA
Duration: Nov 29 1993Dec 3 1993

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


OtherProceedings of the Fall 1993 MRS Meeting
CityBoston, MA, USA


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