Abstract
The micro-wedge scratch technique was applied to characterize interfacial properties of copper fine lines on PMDA-ODA polyimide. A 20 μm wide, 0.1 μm radius wedge-shaped diamond tip was used to mechanically debond Cu fine lines from polyimide substrate. Copper fine lines varies from 0.2 to 0.4 μm thick, and from 1 μm to 100 μm wide. Both cohesive and adhesive delaminations were obtained. Load-displacement curves were recorded and the scratch morphologies were observed by SEM. From a first order calculation, the fracture toughness of the polyimide and interfacial strength of Cu-PI were obtained.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 571-576 |
| Number of pages | 6 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 338 |
| DOIs | |
| State | Published - 1994 |
| Event | Proceedings of the 1994 MRS Spring Meeting - San Francisco, CA, USA Duration: Apr 5 1994 → Apr 8 1994 |
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