The micro-wedge scratch technique was applied to characterize interfacial properties of copper fine lines on PMDA-ODA polyimide. A 20 μm wide, 0.1 μm radius wedge-shaped diamond tip was used to mechanically debond Cu fine lines from polyimide substrate. Copper fine lines varies from 0.2 to 0.4 μm thick, and from 1 μm to 100 μm wide. Both cohesive and adhesive delaminations were obtained. Load-displacement curves were recorded and the scratch morphologies were observed by SEM. From a first order calculation, the fracture toughness of the polyimide and interfacial strength of Cu-PI were obtained.
|Original language||English (US)|
|Number of pages||6|
|Journal||Materials Research Society Symposium - Proceedings|
|State||Published - 1994|
|Event||Proceedings of the 1994 MRS Spring Meeting - San Francisco, CA, USA|
Duration: Apr 5 1994 → Apr 8 1994