Adhesion strength of Cu/polyimide interfaces by micro-wedge scratching

F. Wang, J. C. Nelson, H. Huang, R. L. Swisher, W. W. Gerberich

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations

Abstract

The micro-wedge scratch technique was applied to characterize interfacial properties of copper fine lines on PMDA-ODA polyimide. A 20 μm wide, 0.1 μm radius wedge-shaped diamond tip was used to mechanically debond Cu fine lines from polyimide substrate. Copper fine lines varies from 0.2 to 0.4 μm thick, and from 1 μm to 100 μm wide. Both cohesive and adhesive delaminations were obtained. Load-displacement curves were recorded and the scratch morphologies were observed by SEM. From a first order calculation, the fracture toughness of the polyimide and interfacial strength of Cu-PI were obtained.

Original languageEnglish (US)
Pages (from-to)571-576
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume338
DOIs
StatePublished - 1994
EventProceedings of the 1994 MRS Spring Meeting - San Francisco, CA, USA
Duration: Apr 5 1994Apr 8 1994

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