Adhesion of tungsten fine lines of SiO2 by micro-wedge scratching

M. P. de Bore, H. Huang, J. C. Nelson, F. Wang, William W Gerberich

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Microscratch testing of thin films has mainly been done with a conical tip. In the wedge scratch technique introduced in this paper, thin film fine lines are scratched by a wedge-shaped diamond tip until a spallation occurs. A near plane strain situation arises, and finite element method (FEM) analysis is applied for more accurate evaluation of the work of adhesion. The material system used to demonstrate the micro-wedge scratch technique is rf-sputtered tungsten on thermally grown SiO2. When scratching a long line, delamination occurs by tow mechanism. At loads above 8-9mN/μm (normal load per unit line width), tensile stresses behind the indenter tip cause the tungsten to crack, and the thin film subsequently curls up. At loads above 11mN/μm, high shear stresses in front of the indenter cause delamination of the tungsten at the interface. This latter event is modeled by FEM using a biomaterial fracture mechanics approach to obtain a practical work of adhesion value.

Original languageEnglish (US)
Title of host publicationInterface Control of Electrical, Chemical, and Mechanical Properties
EditorsPeter Borgesen, Klavs F. Jensen, Roger A. Pollak
PublisherPubl by Materials Research Society
Number of pages6
ISBN (Print)1558992170
StatePublished - 1994
EventProceedings of the Fall 1993 MRS Meeting - Boston, MA, USA
Duration: Nov 29 1993Dec 3 1993

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


OtherProceedings of the Fall 1993 MRS Meeting
CityBoston, MA, USA


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