Active thermal cooling using liquid dielectrophoresis

Krishnadas Narayanan Nampoothiri, Vinod Srinivasan, M. S. Bobji, Prosenjit Sen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

On-chip cooling poses a potential challenge in semiconductor industry. Electronic devices generate more heat when scaled down and thus heat needs to be dissipated effectively. For cooling local hot spots on electronic chips, Electrowetting on Dielectric (EWOD) based droplet cooling has been adapted. But here the performance of droplet evaporation is limited by the area of cooling at a particular time. Therefore, the technology needs efficient control over the droplets in order to maximize the cooling rate. In the present work, a large hot spot area (15mm2) has been cooled using a single deionized water drop by inducing non-uniform electric field. Water droplet on two coplanar electrodes, upon applying AC voltage, experiences non-uniform electric field and spreads along the electrodes. This phenomenon, known as Liquid Dielectrophoresis (L-DEP), enables the drop to spread. Cr/Au coplanar electrodes have been patterned with 100μm gap along with a back side aligned Ti/Pt heater in the gap between the coplanar electrodes. Heat flux of 100W/cm2 is applied to the heater by constant power mode and effective evaporation of the drop provides 76% of the cooling of the heated area. The power consumption for the droplet spreading is calculated as 30.2μW moving with an average velocity of 2.8 mm/s.

Original languageEnglish (US)
Title of host publication2016 3rd International Conference on Emerging Electronics, ICEE 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509036592
DOIs
StatePublished - Oct 18 2017
Event3rd International Conference on Emerging Electronics, ICEE 2016 - Mumbai, India
Duration: Dec 27 2016Dec 30 2016

Publication series

Name2016 3rd International Conference on Emerging Electronics, ICEE 2016

Other

Other3rd International Conference on Emerging Electronics, ICEE 2016
Country/TerritoryIndia
CityMumbai
Period12/27/1612/30/16

Bibliographical note

Funding Information:
The authors would like to thank Indian Institute of Science for the financial support.

Publisher Copyright:
© 2016 IEEE.

Keywords

  • Cooling
  • droplet
  • evaporation
  • liquid dielectrophoresis

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