Keyphrases
Overlayer
100%
Fracture Events
100%
Cu Film
100%
Acoustic Emission Analysis
100%
Indenter
25%
Adhesion
25%
Debonding
25%
Blister
25%
Plastic Deformation
25%
Lower Limit
25%
Order of Magnitude
25%
System Behavior
25%
Film Failure
25%
Work of Adhesion
25%
Crack Tip
25%
Indentation
25%
Plastic Energy Dissipation
25%
Load-displacement Curve
25%
Thin Cu Films
25%
Crack Arrest
25%
Acoustic Emission Signal
25%
Secondary Mechanisms
25%
Interfacial Fracture Energy
25%
Induced Delamination
25%
Strain Energy Release Rate
25%
Radial Crack
25%
Acoustic Emission Energy
25%
Dislocation Emission
25%
Thick Cu
25%
De-adhesion
25%
Emission Criterion
25%
Delamination Area
25%
Strain Energy Release
25%
Engineering
Cu Film
100%
Acoustic Emission
100%
Energy Release
20%
Energy Dissipation
20%
Load Displacement Curve
20%
System Behavior
20%
Indentation
20%
Interfacial Fracture Energy
20%
Strain-Energy Release Rate
20%
Dislocation Emission
20%
Debonding
20%
Crack Arrest
20%
Plastic Deformation
20%
Induced Delamination
20%
Delamination Area
20%
Thin Films
20%
Lower Limit
20%
Work of Adhesion
20%
Crack Tip
20%
Strain Energy
20%
Material Science
Film
100%
Delamination
28%
Plastic Deformation
14%
Crack Tip
14%
Debonding
14%
Indentation
14%
Crack Arrest
14%
Thin Films
14%