Accurate in situ measurement of peak noise and delay change induced by interconnect coupling

Takashi Sato, Dennis Sylvester, Yu Cao, Chenming Hu

Research output: Contribution to journalArticlepeer-review

20 Scopus citations


An accurate in situ noise and delay measurement technique that considers interconnect coupling effects is presented. This paper improves upon previous work by proposing 1) a novel accurate peak detector to measure on-chip crosstalk noise, and 2) in situ measurement structure to characterize the dynamic delay effect. A test chip was fabricated using 0.35-μm process and measured results demonstrate the effectiveness of the proposed technique. Noise peak measurements show 40-60 mV (1.8% average) accuracy to simulation results and dynamic delay change curve match well with SPICE. The proposed measurement technique can be used for interconnect model verification and calibration, and has applications to various design automation tools such as noise-aware static timing analysis.

Original languageEnglish (US)
Pages (from-to)1587-1591
Number of pages5
JournalIEEE Journal of Solid-State Circuits
Issue number10
StatePublished - Oct 2001
Externally publishedYes


  • Crosstalk
  • Delay effects
  • Integrated circuit interconnections
  • Noise measurement
  • Peak detectors


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