A tileable switch module architecture for homogeneous 3D FPGAs

Seyyed Ahmad Razavi, Morteza Saheb Zamani, Kia Bazargan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Scopus citations

Abstract

3D technology is an attractive solution for reducing wirelength in a field programmable gate array (FPGA). However, trough silicon vias (TSV) are limited in number. In this paper, we propose a tilable switch module architecture based on the 3D disjoint switch module for 3D FPGAs. Experimental results over 20 MCNC benchmarks show 62% reduction in the number of TSVs on average and small improvements in horizontal channel width and delay compared to the original 3D disjoint SM.

Original languageEnglish (US)
Title of host publication2009 IEEE International Conference on 3D System Integration, 3DIC 2009
DOIs
StatePublished - Dec 1 2009
Event2009 IEEE International Conference on 3D System Integration, 3DIC 2009 - San Francisco, CA, United States
Duration: Sep 28 2009Sep 30 2009

Publication series

Name2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Other

Other2009 IEEE International Conference on 3D System Integration, 3DIC 2009
CountryUnited States
CitySan Francisco, CA
Period9/28/099/30/09

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