A three dimensional self-folding package (SFP) for electronics

Jeong Hyun Cho, Steve Hu, David H. Gracias

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

We describe the concept of a 3D self-folding package (SFP) for sensors and electronic devices. The strategy is based on a self-assembly strategy wherein 2D panels interconnected with hinges spontaneously fold-up when they are released from the substrate; self-folding can be triggered by temperature or selected chemicals. The strategy enables packaging of devices in porous polyhedral geometries that can either be untethered or substrate-bound. Self-folding can enable packaging of devices in small 3D form factors and may enable efficient cooling due to porosity. The utilization of this self-folding platform to enable 3D packaging of cantilever sensors and magnetic field sensitive strain gauges is summarized.

Original languageEnglish (US)
Title of host publicationAdvanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics
Pages317-321
Number of pages5
StatePublished - Dec 24 2010
Event2010 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 5 2010Apr 9 2010

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1249
ISSN (Print)0272-9172

Other

Other2010 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period4/5/104/9/10

Fingerprint Dive into the research topics of 'A three dimensional self-folding package (SFP) for electronics'. Together they form a unique fingerprint.

Cite this