A Technique for Enhancing Boiling Heat Transfer with Application to Cooling of Electronic Equipment

S. M. You, Terrence W. Simon, Avram Bar-Cohen

Research output: Contribution to journalArticlepeer-review

63 Scopus citations

Abstract

Particle layering is introduced as an effective and convenient technique for enhancing boiling nucleation on a surface. Because it can be applied without stress or damage to a surface, it may be implemented in immersion cooling, with boiling, of electronic equipment components. Such an enhanced surface, which has an increased number of nucleation sites, shows a decreased level of wall superheat under boiling and an increased critical heat flux (CHF) relative to superheat and CHF values for an untreated surface. Application of this technique results in a decrease of heated surface temperature and a more uniform temperature of the heated surface; both effects are important in immersion cooling of electronic equipment.

Original languageEnglish (US)
Pages (from-to)823-831
Number of pages9
JournalIEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume15
Issue number5
DOIs
StatePublished - Oct 1992

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