A Scalable Multi-Chip Self-Aligning Ka-Band Phased Array

Ruixing He; Alireza Rouhafza; Yahya Tousi

doi:10.1109/esscirc59616.2023.10268793

A Scalable Multi-Chip Self-Aligning Ka-Band Phased Array

Ruixing He
, Alireza Rouhafza
, Yahya Tousi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

This work presents a scalable phased array architecture based on background phase alignment between its nearest neighbors. We implement the proposed interferometric phase monitoring scheme in a multi-chip array configuration with chip-to-chip bonding between adjacent modules. The prototype 1× 7 phased array consists of 7 transmitter chips and 6 control chips all fabricated in the TSMC 65 n m CMOS process. The die areas of the two modules are 0.86 m m2 and 0.41 m m2, respectively. The array demonstrates a measured ± 30° beam steering consistent with 210° measured phase tuning range between adjacent neighbors. The transmitter phase noise is-114.6dBc/Hz at 1MHz offset at 30GHz and operates across a 16.7% fractional bandwidth. To the best of our knowledge, this work presents the first scalable self-aligning and beam steering mm-wave phased array.

Original language	English (US)
Title of host publication	ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference
Publisher	IEEE Computer Society
Pages	461-464
Number of pages	4
ISBN (Electronic)	9798350304206
DOIs	https://doi.org/10.1109/esscirc59616.2023.10268793
State	Published - 2023
Externally published	Yes
Event	49th IEEE European Solid State Circuits Conference, ESSCIRC 2023 - Lisbon, Portugal Duration: Sep 11 2023 → Sep 14 2023

Publication series

Name	European Solid-State Circuits Conference
Volume	2023-September
ISSN (Print)	1930-8833

Conference

Conference	49th IEEE European Solid State Circuits Conference, ESSCIRC 2023
Country/Territory	Portugal
City	Lisbon
Period	9/11/23 → 9/14/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

Keywords

Phased array
mm-wave
phase control
scalable

Publisher link

10.1109/esscirc59616.2023.10268793

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He, R, Rouhafza, A & Tousi, Y 2023, A Scalable Multi-Chip Self-Aligning Ka-Band Phased Array. in ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference. European Solid-State Circuits Conference, vol. 2023-September, IEEE Computer Society, pp. 461-464, 49th IEEE European Solid State Circuits Conference, ESSCIRC 2023, Lisbon, Portugal, 9/11/23. https://doi.org/10.1109/esscirc59616.2023.10268793

@inproceedings{1402161c39ec4d7c8672db0de461782b,

title = "A Scalable Multi-Chip Self-Aligning Ka-Band Phased Array",

abstract = "This work presents a scalable phased array architecture based on background phase alignment between its nearest neighbors. We implement the proposed interferometric phase monitoring scheme in a multi-chip array configuration with chip-to-chip bonding between adjacent modules. The prototype 1× 7 phased array consists of 7 transmitter chips and 6 control chips all fabricated in the TSMC 65 n m CMOS process. The die areas of the two modules are 0.86 m m2 and 0.41 m m2, respectively. The array demonstrates a measured ± 30° beam steering consistent with 210° measured phase tuning range between adjacent neighbors. The transmitter phase noise is-114.6dBc/Hz at 1MHz offset at 30GHz and operates across a 16.7\% fractional bandwidth. To the best of our knowledge, this work presents the first scalable self-aligning and beam steering mm-wave phased array.",

keywords = "Phased array, mm-wave, phase control, scalable",

author = "Ruixing He and Alireza Rouhafza and Yahya Tousi",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 49th IEEE European Solid State Circuits Conference, ESSCIRC 2023 ; Conference date: 11-09-2023 Through 14-09-2023",

year = "2023",

doi = "10.1109/esscirc59616.2023.10268793",

language = "English (US)",

series = "European Solid-State Circuits Conference",

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booktitle = "ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference",

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AU - He, Ruixing

AU - Rouhafza, Alireza

AU - Tousi, Yahya

PY - 2023

Y1 - 2023

N2 - This work presents a scalable phased array architecture based on background phase alignment between its nearest neighbors. We implement the proposed interferometric phase monitoring scheme in a multi-chip array configuration with chip-to-chip bonding between adjacent modules. The prototype 1× 7 phased array consists of 7 transmitter chips and 6 control chips all fabricated in the TSMC 65 n m CMOS process. The die areas of the two modules are 0.86 m m2 and 0.41 m m2, respectively. The array demonstrates a measured ± 30° beam steering consistent with 210° measured phase tuning range between adjacent neighbors. The transmitter phase noise is-114.6dBc/Hz at 1MHz offset at 30GHz and operates across a 16.7% fractional bandwidth. To the best of our knowledge, this work presents the first scalable self-aligning and beam steering mm-wave phased array.

AB - This work presents a scalable phased array architecture based on background phase alignment between its nearest neighbors. We implement the proposed interferometric phase monitoring scheme in a multi-chip array configuration with chip-to-chip bonding between adjacent modules. The prototype 1× 7 phased array consists of 7 transmitter chips and 6 control chips all fabricated in the TSMC 65 n m CMOS process. The die areas of the two modules are 0.86 m m2 and 0.41 m m2, respectively. The array demonstrates a measured ± 30° beam steering consistent with 210° measured phase tuning range between adjacent neighbors. The transmitter phase noise is-114.6dBc/Hz at 1MHz offset at 30GHz and operates across a 16.7% fractional bandwidth. To the best of our knowledge, this work presents the first scalable self-aligning and beam steering mm-wave phased array.

KW - Phased array

KW - mm-wave

KW - phase control

KW - scalable

UR - https://www.scopus.com/pages/publications/85175231594

UR - https://www.scopus.com/pages/publications/85175231594#tab=citedBy

U2 - 10.1109/esscirc59616.2023.10268793

DO - 10.1109/esscirc59616.2023.10268793

M3 - Conference contribution

AN - SCOPUS:85175231594

T3 - European Solid-State Circuits Conference

SP - 461

EP - 464

BT - ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference

PB - IEEE Computer Society

T2 - 49th IEEE European Solid State Circuits Conference, ESSCIRC 2023

Y2 - 11 September 2023 through 14 September 2023

ER -

A Scalable Multi-Chip Self-Aligning Ka-Band Phased Array

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