A plastic damage model for finite element analysis of cracking of silicon under indentation

Haibo Wan, Yao Shen, Qiulong Chen, Youxing Chen

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17 Scopus citations


A modified plastic damage model that accounts for tensile damage and compressive plasticity as well as interactions among them is adopted to simulate the indentationinduced cracking of silicon under Berkovich, cube corner, and Vickers indenters. Simulations with this model capture not only the well-known cracking geometries in indented ceramics, such as radial, median, lateral, and half penny (Vickers indenter) cracks, but also the recent experimentally discovered quarter penny cracks under Berkovich and cube corner pyramidal indenters. The quarter penny cracks are found to be formed by the coalescence of radial and median cracks for the first time in the simulation. Loads at which radial and half penny cracks are initiated in silicon are generally close to the experimental values reported in the literature, and the crack lengths on the sample surface agree well with both the current experimental measurements and analytical results by fracture mechanics.

Original languageEnglish (US)
Pages (from-to)2224-2237
Number of pages14
JournalJournal of Materials Research
Issue number11
StatePublished - Nov 2010

Bibliographical note

Funding Information:
The research was supported by National Science Foundation of China under Project Nos. 50601018, 50971090, and 50890174, and Intel Products (Shanghai) Ltd. The authors are grateful to engineers Max Lei and Ming Peng at Intel for their help in experiments, and grateful to anonymous reviewers for their helpful suggestions.


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