Abstract
A novel ferroelectric semiconductor junction (FSJ) based two-terminal memristor is demonstrated as a synaptic device for the first time. In this novel FSJ device, a metal-ferroelectric semiconductor (FS)-metal crossbar structure is used, instead of a metal-ferroelectric insulator-metal structure for a conventional ferroelectric tunnel junction (FTJ), so that an ultra-thin ferroelectric insulator is not required. Meanwhile, the FSJ also offers energy efficiency advantage over the conventional filament-based resistive random access memory (RRAM) device because the conductance of the FSJ scales with the junction area. Experimentally, a ferroelectric semiconductor α-In2Se3 based crossbar FSJ (c-FSJ) as a synaptic device is demonstrated. Ferroelectric resistive switching is clearly observed in both planar FSJ (p-FSJ) by in-plane polarization switching and c-FSJ by out-of-plane polarization switching. Conductance potentiation and depression in the c-FSJ are measured and benchmarked at both original size and projected to 32 nm node with different synaptic devices. α-In2Se3 c-FSJ shows good on-line learning accuracy (~92 %), low latency and energy consumption due to the short write pulse width and large RON.
| Original language | English (US) |
|---|---|
| Title of host publication | 2019 IEEE International Electron Devices Meeting, IEDM 2019 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9781728140315 |
| DOIs | |
| State | Published - Dec 2019 |
| Externally published | Yes |
| Event | 65th Annual IEEE International Electron Devices Meeting, IEDM 2019 - San Francisco, United States Duration: Dec 7 2019 → Dec 11 2019 |
Publication series
| Name | Technical Digest - International Electron Devices Meeting, IEDM |
|---|---|
| Volume | 2019-December |
| ISSN (Print) | 0163-1918 |
Conference
| Conference | 65th Annual IEEE International Electron Devices Meeting, IEDM 2019 |
|---|---|
| Country/Territory | United States |
| City | San Francisco |
| Period | 12/7/19 → 12/11/19 |
Bibliographical note
Publisher Copyright:© 2019 IEEE.
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